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Silicon Wafer Thinning Machine for Semiconductor Industry
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1516.

Silicon Wafer Thinning Machine for Semiconductor Industry Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Double Side Lapping Machine for IC Processing
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1517.

Semiconductor Wafer Double Side Lapping Machine for IC Processing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Double Side Grinding Equipment
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1518.

IC Silicon Wafer Double Side Grinding Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Polishing Machine
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1519.

Semiconductor Silicon Wafer Double Side Polishing Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Thinning Machine High Precision
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1520.

Semiconductor Silicon Wafer Thinning Machine High Precision Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Grinding Machine
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1521.

Semiconductor Silicon Wafer Double Side Grinding Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Lapping Machine Best Solution
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1522.

Semiconductor Silicon Wafer Lapping Machine Best Solution Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

High Precision Hydraulic Surface Grinding Machine
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1523.

High Precision Hydraulic Surface Grinding Machine Open Details in New Window [Jul 21, 2025]

Features: 1. Robust construction and heavy duty design. 2.The longitudinal movement of the working table is drivn by hydraulic power.Stepless speed regulating. 3.The longitudinal movement of grinding head is driven ...

Company: Taizhou Lingfeng Cnc Technology Co., Ltd.

Hydraulic Surface Grinding Machine for Metal M7140
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1524.

Hydraulic Surface Grinding Machine for Metal M7140 Open Details in New Window [Jul 21, 2025]

Features: 1. Robust construction and heavy duty design. 2.The longitudinal movement of the working table is drivn by hydraulic power.Stepless speed regulating. 3.The longitudinal movement of grinding head is driven ...

Company: Taizhou Lingfeng Cnc Technology Co., Ltd.

PLC Hydraulic Grinder Machine
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1525.

PLC Hydraulic Grinder Machine Open Details in New Window [May 25, 2024]

1. Pictures 2. Parameters Parameters Unit SG4080S SG4080SD2 Working Surface of Table mm 400×800 (16"×32") 400×800 (16"×32") Max.Table Travel mm 850 850 Max.Cross ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd

PLC Hydraulic Grinder Machine
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1526.

PLC Hydraulic Grinder Machine Open Details in New Window [May 25, 2024]

1. Pictures 2. Parameters Parameters Unit SG4080S SG4080SD2 Working Surface of Table mm 400×800 (16"×32") 400×800 (16"×32") Max.Table Travel mm 850 850 Max.Cross ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd

Purchase Surface Grinder
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1527.

Purchase Surface Grinder Open Details in New Window [May 22, 2024]

1. Pictures 2. Parameters Parameters Unit SG3060S SG3060SD Working Surface of Table mm 300×600 (12"×24") 300×600 (12"×24") Max.Table Travel mm 660 660 Max.Cross ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd

Usage Surface Grinder
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1528.

Usage Surface Grinder Open Details in New Window [May 22, 2024]

1. Pictures 2. Parameters Parameters Unit SG4080S SG4080SD2 Working Surface of Table mm 400×800 (16"×32") 400×800 (16"×32") Max.Table Travel mm 850 850 Max.Cross ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd

CE/ISO/UL/GB CNC Surface Grinder
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1529.

CE/ISO/UL/GB CNC Surface Grinder Open Details in New Window [May 22, 2024]

1. Pictures 2. Parameters Parameters Unit SG640CNC-3 SG840CNC-3 SG1050CNC-3 Grinding Square Meter mm 400×600 400×800 500×1000 Table Load kg 600 700 1380 X axis Longitudinal ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd

Newest Surface Grinder
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1530.

Newest Surface Grinder Open Details in New Window [May 22, 2024]

1. Pictures 2. Parameters Parameters Unit SG4080S SG4080SD Working Surface of Table mm 400×800 (16"×32") 400×800 (16"×32") Max.Table Travel mm 850 850 Max.Cross ...

Company: Nantong Zode Machinery Manufacturing Co., Ltd