Jiangsu Profile
Product List
12946. Semiconductor Silicon Wafer Thinning Equipment 
[Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12947. IC Wafer Double Side Lapping Machine High Accuracy [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12948. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12949. Silicon Wafer Thinning Machine for Semiconductor Industry [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12950. Semiconductor Wafer Double Side Lapping Machine for IC Processing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12951. IC Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12952. Semiconductor Silicon Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12953. Semiconductor Silicon Wafer Thinning Machine High Precision [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12954. Semiconductor Silicon Wafer Double Side Grinding Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12955. Semiconductor Silicon Wafer Lapping Machine Best Solution [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
12956. Nail Drill Use Pedicure Foot Dead Skin Removal Sanding Abrasive Cap [Mar 31, 2026]
[Mar 31, 2026] Sanding Cap Size: Sanding Cap Grain: #80-Coarse #120-Medium #180-Fine How to Use Sanding Cap: Sanding Cap Packing: About Wuxi Jicrade Tech Focus: new-product-development-oriented technology ...
Company: Wuxi Jicrade Tech Co., Ltd.
12957. Surface Grinding Machine with Grinding Head Moving (M7150) Table Size 1250mm 1600mm 2000mm [Mar 15, 2026]
[Mar 15, 2026] M7150 horizontal surface grinder Introduce: Performance & characteristic feature: This series of machines were adopted with the grinding wheel to do grinding, it is widely used in machine manufacturing industry for ...
Company: Yancheng C&J Machinery Co., Ltd.
12958. Ultra-Length Micro-Precision Strip Drill-Mill Center PRO Line [Mar 12, 2026]
[Mar 12, 2026] Product Description Structure And Characteristics Long Strip-Dedicated Drilling & Milling Machining Center Series Exclusively for 6-18m long workpieces, this series integrates drilling, milling, tapping, and slotting in ...
Company: Nantong Zongheng Machinery Co., Ltd
12959. Hyper-Speed Micro-Accurate Drilling Tapping Center PRO Line [Mar 12, 2026]
[Mar 12, 2026] Product Description Structure And Characteristics ATC turret automatic tool change device,quick tool change time is 1.4 seconds. Super large column stable,no deformation,high-speed displacement 36m/min. Large span ...
Company: Nantong Zongheng Machinery Co., Ltd
12960. Dual-Mode Mega-Precision Horizontal-Vertical Five-Axis Machining [Mar 12, 2026]
[Mar 12, 2026] Product Description Structure And Characteristics The machine adopts fixed column type,cross sliding table moving structure.The fuselage uses a large stable base,with high rigidity,high stability,and high ...
Company: Nantong Zongheng Machinery Co., Ltd
