Jiangsu Profile
Product List
36586. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... 
[Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36587. Self Developed Motion Control Technology for Domestic High-Precision Semiconductor Solidification ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36588. Domestic Semiconductor Fully Automatic High-Speed and High-Precision Solidification Machine ... [Jan 15, 2024]
[Jan 15, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36589. Domestic Eutectic Machine Equipped with Nanoscale Feedback Air Flotation Motor Power System [Jan 12, 2024]
[Jan 12, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36590. Design of Dynamic Tool Changing Gantry Structure for High Precision Die Attach [Jan 12, 2024]
[Jan 12, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36591. Ultra High Performance Control System and Intelligent Vision System for Die Attach [Jan 11, 2024]
[Jan 11, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36592. Domestic High-Precision Die Attach Machines Have a Wide Range of Application Products [Jan 10, 2024]
[Jan 10, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36593. Solid Crystal Machine with Dynamic Tool Change and Dual Central Axis [Jan 09, 2024]
[Jan 09, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36594. Self Developed Force Control System for High-Precision Crystal Solidification Machine Equipment [Jan 03, 2024]
[Jan 03, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36595. Domestic High Eutectic Machines Have High-Definition Process Observation and Real-Time Feedback [Jan 02, 2024]
[Jan 02, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36596. High Speed and Precision Equipment for High Binding Force Applications [Dec 29, 2023]
[Dec 29, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36597. High Precision Eutectic Machine with Multiple Wafer Feeding for Mass Production [Dec 29, 2023]
[Dec 29, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36598. Domestic High-Precision Solidification Machine Can Handle Large-Sized Wafers [Dec 28, 2023]
[Dec 28, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36599. Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements [Dec 27, 2023]
[Dec 27, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
36600. Domestic Crystal Solidification Machine Meets High Die Bonding Accuracy [Dec 26, 2023]
[Dec 26, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
