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Both Sides Polished 0.635mm 0.254mm 1mm 96% Al2O3 Alumina Ceramic Plate
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13051.

Both Sides Polished 0.635mm 0.254mm 1mm 96% Al2O3 Alumina Ceramic Plate Open Details in New Window [Dec 17, 2025]

Aluminum oxide ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC, semiconductor package,pieced -film reistor, network,resistor, focusing ...

Company: Lianyungang Highborn Technology Co., Ltd.

Precision Bt30 CNC Shrink Tool Holder for Enhanced Performance
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13052.

Precision Bt30 CNC Shrink Tool Holder for Enhanced Performance Open Details in New Window [Dec 13, 2025]

Company Profile About Ssunny company Jiangsu SSunnytools Machinery Technology Co., Ltd. is a CNC tool management integrating science, industry and trade company for over 20 years . SSunnytools Machinery Park is located ...

Company: Jiangsu Shuangyang Machinery Technology Co., Ltd.

Wafer Automatic Transfer System Solution Equipment Factory
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13053.

Wafer Automatic Transfer System Solution Equipment Factory Open Details in New Window [Dec 13, 2025]

Product Description The Wafer Automatic Transfer System is a precision robotic manipulator designed for semiconductor manufacturing, wafer handling, and vacuum process automation. It ensures high-speed, high-precision, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt
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13054.

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt Open Details in New Window [Dec 13, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment
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13055.

Fully Automatic Clip Bonder Machine Manufacturer Die Bonding Equipment Open Details in New Window [Dec 13, 2025]

Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
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13056.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing Open Details in New Window [Dec 13, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Stable Operations and Profitable Returns Lithography Machine
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13057.

High End Stable Operations and Profitable Returns Lithography Machine Open Details in New Window [Dec 13, 2025]

Product Description 1900 Series Advanced Lithography Equipment - Overview The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

1900 Series Precision and Stability Lithography Equipment for Advanced Semiconductor Production
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13058.

1900 Series Precision and Stability Lithography Equipment for Advanced Semiconductor Production Open Details in New Window [Dec 13, 2025]

Product Description 1900 Series Advanced Lithography Equipment - Overview The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience
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13059.

Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience Open Details in New Window [Dec 13, 2025]

Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head
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13060.

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Open Details in New Window [Dec 13, 2025]

High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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13061.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Dec 13, 2025]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Adjustable Drill Li-ion Battery Behappy Carton 25*29cm China 2022 16V
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13062.

Adjustable Drill Li-ion Battery Behappy Carton 25*29cm China 2022 16V Open Details in New Window [Nov 20, 2025]

Product Description product name cordless impact drill model no BHP-PT-002 power types rechargeable supply voltage 220V battery voltage 21V output power 50W impact rate 0-2000/min speed 2000 RPM drill ...

Company: Jiangsu Goldmoon Industry Co., Ltd.

China Soft Rubber Grip Behappy Carton 25*29cm LED Light 16V
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13063.

China Soft Rubber Grip Behappy Carton 25*29cm LED Light 16V Open Details in New Window [Nov 20, 2025]

Product Description product name cordless impact drill model no BHP-PT-002 power types rechargeable supply voltage 220V battery voltage 21V output power 50W impact rate 0-2000/min speed 2000 RPM drill ...

Company: Jiangsu Goldmoon Industry Co., Ltd.

Hand Drill Speed 0-500rpm Behappy Carton 25*29cm Brushless Motor 18V
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13064.

Hand Drill Speed 0-500rpm Behappy Carton 25*29cm Brushless Motor 18V Open Details in New Window [Nov 20, 2025]

Product Description product name cordless impact drill model no BHP-PT-002 power types rechargeable supply voltage 220V battery voltage 21V output power 50W impact rate 0-2000/min speed 2000 RPM drill ...

Company: Jiangsu Goldmoon Industry Co., Ltd.

3 Functions Soft Rubber Grip Behappy Carton Brushless Motor E-36666
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13065.

3 Functions Soft Rubber Grip Behappy Carton Brushless Motor E-36666 Open Details in New Window [Nov 20, 2025]

Product Description product name cordless impact drill model no BHP-PT-002 power types rechargeable supply voltage 220V battery voltage 21V output power 50W impact rate 0-2000/min speed 2000 RPM drill ...

Company: Jiangsu Goldmoon Industry Co., Ltd.