Jiangsu Profile
Product List
14176. Precision Horizontal Swiss CNC Lathe Machine for Metal Turning 
[Apr 01, 2026]
[Apr 01, 2026] Products Description Features 1. Our casting workshop adopts lost foam to guarantee the size and precision of casting parts. 2. All the parts are performed heat treatment, natural failure, vibrating stress ...
Company: SJR Machinery Limited
14177. New Best Quality Orthopedic Surgical Distal Tibiofibular Instrument Set [Apr 02, 2026]
[Apr 02, 2026] Please contact us for full catalog to customize set. More desings are available. Product Description 1-Can be matched with Reversed Femoral Intramedually Nail of differentmodels and sizes. 2-Here are the basic ...
Company: Xc Technology Co., Ltd.
14178. Double-Tooth Shaver Blade 4.0*125mm Coupling/Connection Stryker Formula Sterilization Package [Mar 09, 2026]
[Mar 09, 2026] Product Description Orthopedic planers are divided into gun planers and pencil planers. The gun planer mainly targets the large bones of the human body, and the pen planer mainly targets the small bones or cartilage ...
14179. Light Duty CNC Lathe Machine Single Spindle - 320mm Swing Diameter [Mar 29, 2026]
[Mar 29, 2026] company head CNC Lathe machine for Dia.320mm Product Description CNC Lathe machine for Dia.320mm The machine can process precisely internal or external diameter, face, taper, arc and threading with ...
Company: Yancheng C&J Machinery Co., Ltd.
14180. Supertech C6246e Precision Lathe: Essential Tool for Professionals [Mar 06, 2026]
[Mar 06, 2026] Product Description Product features (1) The surface of the bedways is supersonic frequency hardened. (2) Gears are precisely ground to reduce noise. (3) The spindle system is of high rigidity and precision. (4) The ...
Company: Supertech Machine Tool Co., Ltd.
14181. Supertech Versatile C6246e/1500 Lathe for Advanced Workshop Projects [Mar 05, 2026]
[Mar 05, 2026] Product Description Product features (1) The surface of the bedways is supersonic frequency hardened. (2) Gears are precisely ground to reduce noise. (3) The spindle system is of high rigidity and precision. (4) The ...
Company: Supertech Machine Tool Co., Ltd.
14182. Supertech C6246e/1500 Precision Lathe for Industrial Applications [Mar 04, 2026]
[Mar 04, 2026] Product Description Product features (1) The surface of the bedways is supersonic frequency hardened. (2) Gears are precisely ground to reduce noise. (3) The spindle system is of high rigidity and precision. (4) The ...
Company: Supertech Machine Tool Co., Ltd.
14183. Supertech C6246e/1500 Precision Lathe Machine for Professional Use [Mar 04, 2026]
[Mar 04, 2026] Product Description Product features (1) The surface of the bedways is supersonic frequency hardened. (2) Gears are precisely ground to reduce noise. (3) The spindle system is of high rigidity and precision. (4) The ...
Company: Supertech Machine Tool Co., Ltd.
14184. Supertech Precision Lathe Machine C6246e/1500 [Mar 04, 2026]
[Mar 04, 2026] Product Description Product features (1) The surface of the bedways is supersonic frequency hardened. (2) Gears are precisely ground to reduce noise. (3) The spindle system is of high rigidity and precision. (4) The ...
Company: Supertech Machine Tool Co., Ltd.
14185. Supertech LC300V Compact Mini Lathe for Woodworking and Metalworking [Mar 04, 2026]
[Mar 04, 2026] Product Description LC300v/700 Mini Lathe Product Introduction The LC300V is a compact, high-precision bench lathe designed for versatile metalworking tasks. With a robust cast-iron construction and smooth-running ...
Company: Supertech Machine Tool Co., Ltd.
14186. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
14187. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
14188. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
14189. Precision Die Bonding Equipment for Automated Assembly Solutions [Feb 28, 2026]
[Feb 28, 2026] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment ...
14190. Precision Laser Cutting Equipment for Superior Grooving Performance [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
