Jiangsu Profile
Famous Export Brand
Product List
118711. Advanced Crossbeam Milling Machine for Superior Manufacturing Efficiency 
[Apr 07, 2026]
[Apr 07, 2026] Product Description GENERAL DESCRIPTION This machine tool is a crossbeam mobile high-speed machine with a fixed worktable. It mainly consists of a bed, crossbeam, crossbeam slide, slider, chip removal device, ...
Company: U·BRIGHT SOLUTIONS Co., Ltd.
118712. Premium Metal Zipper Polishing Tools for Flawless Finishes [Apr 07, 2026]
[Apr 07, 2026] Zipper polishing machine centrifugal finishing deburring grinding machine for metal Dry high-speed centrifugal grinding and polishing machine is mainly used for rental, medium and fine grinding and polishing of small ...
Company: U·BRIGHT SOLUTIONS Co., Ltd.
118713. China Brand New 30 Ton Large Remote Control Truck Craneqy30K [Apr 03, 2026]
[Apr 03, 2026] 30 ton mobile truck crane More excellent performance: • The optimizing layout of the machine makes the stress of the main bearing carriers more reasonable, and the lifting performance is higher than the products with ...
118714. Custom Hydraulic Chain Jack System for Tank Lifting Construction [Apr 03, 2026]
[Apr 03, 2026] Product Description WINCOO LYT Series Chain Type Hydraulic Jacks are specialized lifting devices designed for the inverted installation and construction of large steel storage tanks, including fixed-roof and ...
Company: Wincoo Engineering Co., Ltd.
118715. 500cc Harley Prince Cruiser Three Wheel Motorcycle Side Three Wheel [Apr 02, 2026]
[Apr 02, 2026] 500CC Harley Prince Cruiser Three Wheel Motorcycle Side Three Wheel Base Specification Length x width x height (mm) : 2530*1660*1190 Wheelbase (mm) : 1540 Seat height (mm) : 830 Ground clearance (mm) ...
118716. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Apr 02, 2026]
[Apr 02, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
118717. Advanced Aluminum Gold Desktop Wire Bonder for Electronics [Apr 02, 2026]
[Apr 02, 2026] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
118718. Premium Jewelry Polishing Tool Kit for Global Artisans [Apr 01, 2026]
[Apr 01, 2026] Stainless Steel Dry Centrifugal DISC Polishing Finishing Machine For Polishing Jewelry Dry high-speed centrifugal grinding and polishing machine is mainly used for rental, medium and fine grinding and polishing of ...
Company: U·BRIGHT SOLUTIONS Co., Ltd.
118719. Industrial Robotic Stainless Steel Palletizer for Food & Beverage Packaging [Mar 31, 2026]
[Mar 31, 2026] Palletizing System Specification Low-level gantry palletizer Summary: The palletizer is used to stack the film packages that have been loaded into the container on the pallet in a certain arrangement, and then ...
118720. Automatic Efficient Layer Palletizer for Stable Palletizing of Cans & Cartons [Mar 31, 2026]
[Mar 31, 2026] Palletizing System Specification Low-level gantry palletizer Summary: The palletizer is used to stack the film packages that have been loaded into the container on the pallet in a certain arrangement, and then ...
118721. Advanced Laser Processing Systems for Silicon Carbide Wafers [Mar 31, 2026]
[Mar 31, 2026] Customization Silicon Carbide Wafer Laser Processing machine factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD ...
118722. Advanced Multi-Station Vertical Wafer Dryer for Semiconductor Processing [Mar 31, 2026]
[Mar 31, 2026] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
118723. Advanced Five Axis Laser Cutting System for Precision Engineering [Mar 31, 2026]
[Mar 31, 2026] Ultra fast Pulsed Five Axis Laser Micro device Nano Machine system equipment manufacturer Features: The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical ...
118724. Precision Wire Bonding Solutions for Optimized Production Lines [Mar 31, 2026]
[Mar 31, 2026] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
118725. High-Performance Double-Tube Vertical Furnace for Pi Cuer Annealing [Mar 31, 2026]
[Mar 31, 2026] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, ...
