Jiangsu Profile
Product List
45901. Variable Bore RAM Type Cameron Bop Rubber Packer for The Oil Field 
[Mar 05, 2026]
[Mar 05, 2026] The product acan matach and interchange with the equipments of most of the domestic BOP manufactories;After the application in the oil fields over the years, it has been proved that all the techincial requirements and ...
45902. High-Speed Double Pendulum Gantry Milling Machine for Precision Engineering [Mar 03, 2026]
[Mar 03, 2026] Product Description GENERAL DESCRIPTION Introducing the cutting-edge 5-Axis Gantry Milling Center, equipped with a double pendulum head. This sophisticated machinery is engineered to handle large, intricately ...
Company: U·BRIGHT SOLUTIONS Co., Ltd.
45903. IP68 Submersible Level Sensor 4-20mA Liquid Transmitter High Accuracy Liquid Level Gauge [Mar 02, 2026]
[Mar 02, 2026] Product Features Features Integrated structure, simple and convenient Multiple protection and sealing structure design, IP68 protection Double anti-condensation and condensation process Full welding ...
45904. High-Precision Automatic Die Attach Machine for IC Packaging [Feb 28, 2026]
[Feb 28, 2026] Die Bonder This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die bonding machine in the world. Its production capacity and accuracy ...
45905. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
45906. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
45907. Precision Die Bonding Equipment for Automated Assembly Solutions [Feb 28, 2026]
[Feb 28, 2026] Fully automatic Clip Bonder machine manufacturer die bonding equipment The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment ...
45908. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
45909. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
45910. High-Precision Tgv Laser Drilling System for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Tgv High-End Precision Laser Drilling Machine Tgv industrial equipment factory supplier Product Description New Fully Automated Dual-Station Laser Cutter Sets Benchmark for Brittle Material Processing We are ...
45911. Precision Die Bonding Machine for High-Quality Soldering Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
45912. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
45913. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Feb 28, 2026]
[Feb 28, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
45914. High-Precision Gantry Wire Bonder Machine for Diverse Industrial Uses [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...
45915. High Speed Drilling and Tapping Machining Center Frame T6 [Feb 27, 2026]
[Feb 27, 2026] Product Parameters High Speed Drilling and Tapping Machining Center Frame Item Specification Unit T6 Travel Max. travel of X axis mm 600 Max. travel of Y axis mm 400 Max. travel of Z ...
