Jiangsu Profile
Product List
2026. High Performance Aluminum Alloy Cooled Bonded Fin Heat Sink for CPU Processor 
[Jul 31, 2022]
[Jul 31, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2027. Black Anodizing CPU Heat Sink [Jul 21, 2022]
[Jul 21, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2028. Aluminum Extrusion Process Precision Customized Computer CPU Heat Sink Accessoriesnk [Jul 17, 2022]
[Jul 17, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2029. Professional OEM/ODM CPU Aluminum Extrusion Heat Sink [Jul 15, 2022]
[Jul 15, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2030. High Precision OEM Anodized Finish Aluminum Extrusion CPU Heat Sink [Jul 14, 2022]
[Jul 14, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2031. CPU Fan Parts for High Quality Low Cost Computer [Aug 04, 2018]
[Aug 04, 2018] MIM(Metal powder Injection Molding) isthe5th generation of metal forming technology. Over 40 years of development, people gradually find more applications for MIM process especially in the 3C products application. From ...
2032. Thermally Conductive Silicone Interface Pad for CPU GPU Cooling [Aug 21, 2024]
[Aug 21, 2024] 1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...
2033. Custom CPU Cooler Heat Sink Bonded Fin Heat Sink with Heatpipe [May 28, 2022]
[May 28, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2034. High Quality Heat Conductive Thermal Silicone Pad for LED GPU CPU Cooling [Aug 21, 2024]
[Aug 21, 2024] 1. Product Description Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity. Standard size: 400mm*200mm, according to customer needs to cut the ...
2035. Extrusion Process Precision Customized Computer CPU Heat Sink Accessoriesnk [Nov 17, 2022]
[Nov 17, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2036. Jc5 Jc6 CPU Board F13104208A F13104216A [Mar 10, 2023]
[Mar 10, 2023] staubl original JC5 JC6 CPU BOARD F13104208A F13104216A,both new one and 2nd hand board in good condition are supplied.
2037. CPU Fan Parts for High Quality Low Cost Computer Metal Injection Molding [Aug 04, 2018]
[Aug 04, 2018] MIM(Metal powder Injection Molding) isthe5th generation of metal forming technology. Over 40 years of development, people gradually find more applications for MIM process especially in the 3C products application. From ...
2038. High Performance Aluminum Alloy Water Cooled Bonded Fin Heat Sink for CPU Processor [May 27, 2022]
[May 27, 2022] Product Description Aluminum Extruded Profile 1.Alloying Ingredient: 6063/6061. 2.Temper: T3-T8 3.Machining: Cutting, punching, drilling, milling, bending, welding, CNC etc. 4.Finish: ...
2039. High-Conductivity Aluminum Heat Sink for PC CPU Thermal Dissipation [Oct 17, 2025]
[Oct 17, 2025]
Company: Tianhong Power Technology Co., Ltd.
