Jiangsu Profile
Famous Export Brand
Product List
7981. High Quality High Technology Multi Rip Blade Saw Cutting Machine for Spc Flooring Producing 
[May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7982. High Quality Vinyl Flooring Multi Rip Blade Saw Cutting Machine for Spc Flooring Producing [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7983. High Quality High Automation Level Spc Flooring Multi Rip Blade Saw Cutting Machine [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7984. High Quality High Speed Multi Rip Blade Saw Cutting Machine for Spc Flooring [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7985. High Quality PVC Board Multi Rip Blade Saw Cutting Machine for Spc Flooring Producing [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7986. High Quality Stable Running Multi Rip Blade Saw Cutting Machine for Spc Flooring Producing [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7987. Hallmark High Quality Low Maintenance Cost Spc Board Multi Rip Blade Saw Cutting Machine [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7988. New Type High Technology Multi Rip Blade Saw Cutting Machine for Spc Flooring Producing [May 06, 2026]
[May 06, 2026] Equipment parameters Spindle diameter 80mm Spindle motor 18.5KW Transmission motor 2.2KW Production line speed 15-35 meter/minute Operating voltage 380V, 50Hz Control ...
Company: Hallmark International Group Limited
7989. Diamond Wire Saw Machine for Mono Crystalline Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7990. High Performance Wire Saw Machine for Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7991. Factory Price Wire Saw Machine for Solar Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7992. Diamond Wire Saw Machine for Polysilicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7993. Precision Wire Saw Machine for Mono Silicon Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7994. Automatic Multi Wire Saw Machine for Silicon Ingot Cutting [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line This product is a specialized processing equipment for cutting semiconductor single-crystal silicon wafers using diamond wire. It can process silicon ...
7995. Long-Life Burr-Free Cutting Diamond Circular Saw Blade for PVC Board Cutting [Mar 20, 2026]
[Mar 20, 2026] Product Description Product Description 1.Application:Suitable for cutting new type boards such as PVC, WPC and SPC, as well as medium and high density fiberboards (MDF/HDF). It meets the cutting needs of board ...
