Jiangsu Profile
Product List
7036. Photonics Packaging Die Bonding Machine 
[Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7037. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7038. IC Packaging Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7039. Fully Automatic High Precision Epoxy Die Bonding Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7040. Multi Die Chip Epoxy Bonding Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7041. Multi Strip Advanced Die Bonding Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7042. Bozhon High-Quality Production Die Bonder Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7043. Semiconductor High-Precision Die Attch Provide Flexible Packaging Capabilities for Advanced ... [Jan 16, 2024]
[Jan 16, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7044. Design of Dynamic Tool Changing Gantry Structure for High Precision Die Attach [Jan 12, 2024]
[Jan 12, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7045. Ultra High Performance Control System and Intelligent Vision System for Die Attach [Jan 11, 2024]
[Jan 11, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7046. Domestic High-Precision Die Attach Machines Have a Wide Range of Application Products [Jan 10, 2024]
[Jan 10, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7047. Domestic Crystal Solidification Machine Meets High Die Bonding Accuracy [Dec 26, 2023]
[Dec 26, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7048. Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module [Dec 21, 2023]
[Dec 21, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7049. Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine China Factory [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
7050. Handmade Sub-Micron Level Die Attach Accuracy Machine [Dec 05, 2023]
[Dec 05, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
