Jiangsu Profile
Product List
20506. High Precision Round Pipe Square Tube CNC Plasma Cutter Equipment Laser Cutting Machine Price 
[Sep 05, 2022]
[Sep 05, 2022] High Precision Round Pipe Square Tube CNC Plasma Cutter Equipment Laser Cutting Machine Price Product Description Advertising industry: Advertising signs, logo making, decorative products, production of ...
20507. Plastic Extruder Machine PVC Foam Plate Board Making Machine [Dec 22, 2025]
[Dec 22, 2025] Plastic Extruder Machine PVC Foam Plate Board Making Machine Product Description PVC Free Foam Sheet / PVC Free Foam Board is the new man-made material, the main component is PVC, it has the fine chemical stability, ...
20508. High-Precision UV Laser Marking Machine for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description The UV laser marking machine is developed using a 355nm UV laser, which adopts third-order intracavity frequency doubling technology. Compared with infrared laser, the 355nm UV focused spot is ...
20509. Expiry Date Coding Logo Printing Number Marking CO2 Laser Flying Machine for Plastic Water Bottle ... [Jul 16, 2025]
[Jul 16, 2025] Co2 Flying Laser Marking Machine (Can be customized to your needs) Our portable laser markers boast unrivaled adaptability and versatility, far exceeding traditional markers. They are ideally suited for a plethora of ...
Company: SUZHOU HND LASER CO., LTD
20510. High Speed Plastic Bag Paper Pouch Flexographic Printing Machine Flexible Die [Aug 23, 2024]
[Aug 23, 2024] High Speed Plastic Bag Paper Pouch Flexographic Printing Machine Flexible Die Product Description Flexible Die from JetFly In order to produce precision flexible dies, JetFly bought advanced engraving machines. ...
20511. Roll to Roll UV Adhesive Tape Printer Horizontal Printing Machine Die [Aug 23, 2024]
[Aug 23, 2024] Roll to Roll UV Adhesive Tape Printer Horizontal Printing Machine Die Product Description Flexible Die from JetFly In order to produce precision flexible dies, JetFly bought advanced engraving machines. Moreover we ...
20512. Stainless Steel Flexo Machine Flexible Cutting Die for Self-Adhesive Sticker, Vinly Sticker [Aug 23, 2024]
[Aug 23, 2024] Stainless Steel Flexo machine Flexible Cutting die for self-adhesive sticker, vinly sticker Product Description Flexible Die from JetFly In order to produce precision flexible dies, JetFly bought advanced ...
20513. Flexograpgic Printing Machine Flexo Printing Machine Flexible Die [Aug 23, 2024]
[Aug 23, 2024] flexograpgic printing machine flexo printing machine Flexible die Product Description Flexible Die from JetFly In order to produce precision flexible dies, JetFly bought advanced engraving machines. Moreover we ...
20514. OSD-860PUR Sheet Materials PUR Hot Melt Adhesive Laminating Machine [Dec 01, 2025]
[Dec 01, 2025] Product Description Product Description Machines in this series can be widely used in the production of sanitary products (diaper and hygiene products). air filter, refrigerator, adhesive paper against rat and fly; non ...
Company: Suzhou Oushida Hot Melt Machinery Equipment Co., Ltd.
20515. Advanced Automatic Die Bonding Machine for Precision Soldering [Dec 13, 2025]
[Dec 13, 2025] High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
20516. Equipment Factory Rapid Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] Equipment factory Rapid wire bonding machine for production line Product Description Technical Specifications: Wire Bonding Capability Ultra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad Pitch Wire ...
20517. High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
20518. Advanced Laser Wafer Marking Machine for Semiconductor Production [Dec 13, 2025]
[Dec 13, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
20519. 12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly [Dec 13, 2025]
[Dec 13, 2025] 12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...
20520. High-Speed Wire Bonding Machine for Production Line [Dec 13, 2025]
[Dec 13, 2025] High-Speed Wire Bonding Machine for Production Line Product Description High-Performance Automatic Wire Bonder This equipment is a state-of-the-art automatic wire bonding machine designed for high-mix, high-volume ...
