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Automatic Metallographic Grinding and Polishing Machine Water Cooling Device Constant Speed ...
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4351.

Automatic Metallographic Grinding and Polishing Machine Water Cooling Device Constant Speed ... Open Details in New Window [Mar 27, 2025]

Model Alpha-112 Working disc Number of Discs Single disc Maximum diameter 12"/305mm Rotating speed 50 - 600rpm Rotating ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

Beta-300 PRO Coolant-Fed Lab-Use Metallographic Specimen Cut Machine Sample Preparation Ultra-Large ...
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4352.

Beta-300 PRO Coolant-Fed Lab-Use Metallographic Specimen Cut Machine Sample Preparation Ultra-Large ... Open Details in New Window [Mar 27, 2025]

Model Beta-300 Pro Cutting blade Rotation speed 800~3500rpm Diameter Φ300mm Arbor size 32mm Electronic Input 3x380V/50Hz+ground line Rated power Total power 5.0KW, Cutting power 4KW Safety Emergency ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

Water Cooling Manually Metal Material Metallographic Sample Cutting Machine CT-250s/CT-250V ...
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4353.

Water Cooling Manually Metal Material Metallographic Sample Cutting Machine CT-250s/CT-250V ... Open Details in New Window [Mar 27, 2025]

Model CT-250S CT-250V Max. Dia Φ250mm Cutting Capacity Φ80mm Feeding Mode Manual Dimpowerension of table 210x230mm Power 2.2KW Power supply 3x380V/50Hz Standard (220,440,480V/60Hz ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

CT-2300 Lab-Use Precision Automatic Operation Metallographic Cutting Machine Laboratory Precision ...
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4354.

CT-2300 Lab-Use Precision Automatic Operation Metallographic Cutting Machine Laboratory Precision ... Open Details in New Window [Mar 27, 2025]

Model CT-2300 Cutting Method Manual The blade moves by operating a hand-wheel Wheel Diameter Φ180-230mm Arbor size 12.7mm Speed 200~3000rpm Cutting Capacity Max round shape Φ30mm Max square ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

Alpha-212 Metallographic Sample Grinding Machine, Metal Jade Ceramic Polishing Equipment
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4355.

Alpha-212 Metallographic Sample Grinding Machine, Metal Jade Ceramic Polishing Equipment Open Details in New Window [Mar 27, 2025]

Model Alpha-212 Working wheel Wheel Double wheels Max. dia. 12/305mm Speed 0 - 600rpm stepless speed adjustment Direction CW/CCW Torque 10N.m Electronic Voltage/Frequency 220V/50Hz (1Ph/N/PE) Rated ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

Alpha-212 Lab-Grade Laboratory Testing Machine Metallographic Sample Grinding and Polishing ...
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4356.

Alpha-212 Lab-Grade Laboratory Testing Machine Metallographic Sample Grinding and Polishing ... Open Details in New Window [Mar 27, 2025]

Model Alpha-212 Working wheel Wheel Double wheels Max. dia. 12/305mm Speed 0 - 600rpm stepless speed adjustment Direction CW/CCW Torque 10N.m Electronic Voltage/Frequency 220V/50Hz (1Ph/N/PE) Rated ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

CT-2300 Precision Lab-Use Testing Equipment Specimen Automatic Metallographic Sample Cutting ...
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4357.

CT-2300 Precision Lab-Use Testing Equipment Specimen Automatic Metallographic Sample Cutting ... Open Details in New Window [Mar 27, 2025]

Model CT-2300 Cutting Method Manual The blade moves by operating a hand-wheel Wheel Diameter Φ180-230mm Arbor size 12.7mm Speed 200~3000rpm Cutting Capacity Max round shape Φ30mm Max square ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

CT-250s/CT-250V Precision Lab Speed and Precision Automatic Metallographic Sample Cutting Machine ...
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4358.

CT-250s/CT-250V Precision Lab Speed and Precision Automatic Metallographic Sample Cutting Machine ... Open Details in New Window [Mar 27, 2025]

Model CT-250S CT-250V Max. Dia Φ250mm Cutting Capacity Φ80mm Feeding Mode Manual Dimpowerension of table 210x230mm Power 2.2KW Power supply 3x380V/50Hz Standard (220,440,480V/60Hz ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

CT-2300 Lab-Use Precision Sectioning Machine Cutting Machine Manufacturers Other Metal Cutting ...
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4359.

CT-2300 Lab-Use Precision Sectioning Machine Cutting Machine Manufacturers Other Metal Cutting ... Open Details in New Window [Mar 27, 2025]

Model CT-2300 Cutting Method Manual The blade moves by operating a hand-wheel Wheel Diameter Φ180-230mm Arbor size 12.7mm Speed 200~3000rpm Cutting Capacity Max round shape Φ30mm Max square ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

OEM/ODM CT-2300 Lab-Use Fully Automatic Metallographic Sample Cutting Machine High Precision Flat ...
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4360.

OEM/ODM CT-2300 Lab-Use Fully Automatic Metallographic Sample Cutting Machine High Precision Flat ... Open Details in New Window [Mar 27, 2025]

Model CT-2300 Cutting Method Manual The blade moves by operating a hand-wheel Wheel Diameter Φ180-230mm Arbor size 12.7mm Speed 200~3000rpm Cutting Capacity Max round shape Φ30mm Max square ...

Company: Trojan (Suzhou) Material Technology Co., Ltd.

High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal ...
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4361.

High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal ... Open Details in New Window [Mar 20, 2025]

High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Xinzhe Vtc50p CNC Machine Tools Machinery Industrial Machinery Lathe CNC Machining Center Machine ...
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4362.

Xinzhe Vtc50p CNC Machine Tools Machinery Industrial Machinery Lathe CNC Machining Center Machine ... Open Details in New Window [Mar 19, 2025]

DESCRIPTION Adopt fixed table, XYZ three linear axes are spindle moving elevated bridge type full dynamic column structure, as shown in the above figure; table and workpiece remain static during machining, and the ...

Company: Nanjing Xinzhe Cnc Machine Tool Co., Ltd.

Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System
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4363.

Sic Laser Annealing Semiconductor Equipment Equipped with Efem Transmission System Open Details in New Window [Mar 19, 2025]

Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers 2. Integrated self-developed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Improve Surface Adhesion Plasma Cleaning Equipment with Fine Cleaning and Static Elimination
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4364.

Improve Surface Adhesion Plasma Cleaning Equipment with Fine Cleaning and Static Elimination Open Details in New Window [Mar 19, 2025]

Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - fault sound and light alarm and menu ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Remove Dust/Oil/Fine Cleaning/Static Electricity Plasma Cleaning Equipment
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4365.

Remove Dust/Oil/Fine Cleaning/Static Electricity Plasma Cleaning Equipment Open Details in New Window [Mar 19, 2025]

Product Description Product features: 1. Adjustable - use electric amplitude modulation for the conveying mechanism, and the width can be adjusted arbitrarily; 2. Inline conveying system - used for communicating ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.