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Advanced Lpcvd Furnace with Innovative Smart Interface Solution
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55246.

Advanced Lpcvd Furnace with Innovative Smart Interface Solution Open Details in New Window [Sep 28, 2026]

Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Professional Grade Fiber Laser Cutter for Industrial Use
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55247.

Professional Grade Fiber Laser Cutter for Industrial Use Open Details in New Window [Sep 28, 2026]

Product Description Mps-0806h is a product specially for the sheet metal industry. It is mainly used for sheet metal cutting, closed structure, excellent performance, stability and high cost performance. Model ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Engraving Machine for Custom Gear Design
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55248.

High-Precision Laser Engraving Machine for Custom Gear Design Open Details in New Window [Sep 28, 2026]

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision UV Laser Engraver for Metal and Plastic Items
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55249.

Precision UV Laser Engraver for Metal and Plastic Items Open Details in New Window [Sep 28, 2026]

UV Laser Marking Machine on Metal Glass Cup Plastic Rubber Leather Water Bottle Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Smart Automated Microchip Dispensing Solutions for Manufacturing Efficiency
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55250.

Smart Automated Microchip Dispensing Solutions for Manufacturing Efficiency Open Details in New Window [Sep 28, 2026]

Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Semiconductor Wafer Bonder for Advanced Die Bonding
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55251.

High-Precision Semiconductor Wafer Bonder for Advanced Die Bonding Open Details in New Window [Sep 28, 2026]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Intelligent Dispensing Station with Advanced Ai Vision Recognition
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55252.

Intelligent Dispensing Station with Advanced Ai Vision Recognition Open Details in New Window [Sep 28, 2026]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Thick Wall API Tube Mill ERW Tube Mill Pipe Making Tube Mill
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55253.

Thick Wall API Tube Mill ERW Tube Mill Pipe Making Tube Mill Open Details in New Window [Sep 27, 2026]

Product Description Round to Square ERW Tube Mill without change rolls (Support customization) Model Round Pipe Square & Rectangular Pipe OD/mm Thickness/mm Size/mm Thinckness/mm ZQF127 ø40-ø127 1.0-6.0 30x30-100x100 ...

Company: NANJING NANQING ZHONGQING MACHINE MAKING CO., LTD.

ERW Round Square Tube Mill API Tube Mill Heavy Duty Tube Mill
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55254.

ERW Round Square Tube Mill API Tube Mill Heavy Duty Tube Mill Open Details in New Window [Sep 27, 2026]

Product Description Round to Square ERW Tube Mill without change rolls (Support customization) Model Round Pipe Square & Rectangular Pipe OD/mm Thickness/mm Size/mm Thinckness/mm ZQF127 ø40-ø127 1.0-6.0 30x30-100x100 ...

Company: NANJING NANQING ZHONGQING MACHINE MAKING CO., LTD.

High-Precision Automatic Die Bonder for LED Packaging Efficiency
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55255.

High-Precision Automatic Die Bonder for LED Packaging Efficiency Open Details in New Window [Sep 28, 2026]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Marking Machine for Electronics and Components
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55256.

Advanced Laser Marking Machine for Electronics and Components Open Details in New Window [Sep 28, 2026]

High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Trimming Solutions for Efficient PCB Production
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55257.

Advanced Laser Trimming Solutions for Efficient PCB Production Open Details in New Window [Sep 28, 2026]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Gear Rack Fiber Laser Cutter for Metal and More
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55258.

Advanced Gear Rack Fiber Laser Cutter for Metal and More Open Details in New Window [Sep 28, 2026]

Effectively Open Fiber Laser Cutting Machine Adopts Gear Rack Transmission Structure Product Description MPS-3015D series laser cutting machine adopts gear rack transmission structure, effectively ensure the running ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced CCD Glue Dispensing System for Electronics Assembly
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55259.

Advanced CCD Glue Dispensing System for Electronics Assembly Open Details in New Window [Sep 28, 2026]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage stabilizer ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Drilling Machine for Advanced Tsv Applications
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55260.

High-Precision Laser Drilling Machine for Advanced Tsv Applications Open Details in New Window [Sep 28, 2026]

Product Description Product Features Customized ultra-fast picosecond / femtosecond lasers with low thermal effects Self-developed drilling process technology which meets different process requirements Excellent ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.