Jiangsu Profile
Product List
8536. Kd-D350 Light Shielding Film Die Cutter 
[Jun 13, 2026]
[Jun 13, 2026] Machine Introduction Equipment Name: Asynchronous Die-Cutting Machine Model: KD-YB450C Applicable Materials: Cover film, shielding film, FPC, PP film, copper foil, silver foil, silicone, etc. Functions: Online ...
8537. Automatic Flatbed RFID Sticker Barcode Tags Label Die Cutting Machine (die cutter) [Jun 13, 2026]
[Jun 13, 2026] Machine Introduction Equipment Name: Asynchronous Die-Cutting Machine Model: KD-YB450C Applicable Materials: Cover film, shielding film, FPC, PP film, copper foil, silver foil, silicone, etc. Functions: Online ...
8538. Automatic Hook and Loop Die Cutting Machine Half Cutting Machine Price [Jun 13, 2026]
[Jun 13, 2026] Machine Introduction Equipment Name: Asynchronous Die-Cutting Machine Model: KD-YB450C Applicable Materials: Cover film, shielding film, FPC, PP film, copper foil, silver foil, silicone, etc. Functions: Online ...
8539. Induction Cap Seal Liner, Foam Tape Die Cutting Machine [Jun 13, 2026]
[Jun 13, 2026] Machine Introduction Equipment Name: Asynchronous Die-Cutting Machine Model: KD-YB450C Applicable Materials: Cover film, shielding film, FPC, PP film, copper foil, silver foil, silicone, etc. Functions: Online ...
8540. Conductive Film EMI Shielding Materials Die Cutting Machine [Jun 06, 2026]
[Jun 06, 2026] Machine Introduction Equipment Name: Asynchronous Die-Cutting Machine Model: KD-YB450C Applicable Materials: Cover film, shielding film, FPC, PP film, copper foil, silver foil, silicone, etc. Functions: Online ...
8541. Medical Grade Femtosecond Laser Cutting Machine for Surgical Instrument Manufacturing [May 14, 2026]
[May 14, 2026] Femtosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's Femtosecond laser machines are qualified for various kinds of consumer electronics, such as mobile phone and wearable equipment , which feature strict ...
8542. Precision Ceramic IC Test Socket Laser Cutting Machine Crack Free Edges [May 14, 2026]
[May 14, 2026] UV Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides UV picosecond laser cutting machines can accurately adapt to the core component processing requirements of various IC test sockets, especially in ...
8543. Advanced Double-Station Picosecond Laser Cutting Machine for Efficient Micro-Processing [May 12, 2026]
[May 12, 2026] Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...
8544. High Efficiency Picosecond Laser Cutting Machine for Fast Copper Foil Processing [May 12, 2026]
[May 12, 2026] Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...
8545. Photoelectric Efficient Laser Marking Machine for Fine Carving Work [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
8546. Non Burn UV Laser Marking Machine for Precision Surface Marking [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
8547. Industrial Grade Laser Marking Machine for Communication Devices [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
8548. Premium Grade Laser Marking Machine for Electronic Components [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
8549. Micro Drilling UV Laser Marking Machine for Silicon Wafer Process [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
8550. Clear Qr Code Laser Marking Machine for LCD Glass Application [May 11, 2026]
[May 11, 2026] 1.Ultra-Small Heat-Affected Zone: Minimizes thermal impact to avoid deformation or charring, significantly boosting production yields. 2.Versatile Material Processing: Complements and excels where conventional infrared ...
