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High Precision High Power Ultraviolet Picosecond Laser Cutting Machine
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16396.

High Precision High Power Ultraviolet Picosecond Laser Cutting Machine Open Details in New Window [Jul 22, 2025]

Product Description Ultraviolet picosecond laser cutting machine It adopts a precision marble platform, which is stable in load-bearing and corrosion-resistant. High-precision galvanometer scanning head, with low ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Djj-120 Automatic Chamfering Machine for Semiconductor Wafer
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16397.

Djj-120 Automatic Chamfering Machine for Semiconductor Wafer Open Details in New Window [Jul 22, 2025]

Product Description Chamfering machine is one of the key equipment used in semiconductor chip preparation process, responsible for grinding irregular shaped chip contours into standard wafers, and high-precision ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Performance 99% UV Blocking 90% Infrared Rejection Nano-Ceramic Car Window Film
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16398.

High Performance 99% UV Blocking 90% Infrared Rejection Nano-Ceramic Car Window Film Open Details in New Window [Jul 22, 2025]

Company Profile TPU full industry chain manufacturers 7300 square meters of high-end window film intelligent manufacturing base, window film monthly production capacity of 12 million square meters, products are ...

Company: Nanolink New Material (Nantong) Co., Ltd

Slkj Series High Precis Thick Film Sintering Furnace
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16399.

Slkj Series High Precis Thick Film Sintering Furnace Open Details in New Window [Jul 22, 2025]

Product Description Mainly used for high temperature sintering process of thick film printed circuit (resistors, conductors, glass) products, especially in the fields of chip resistors, LTCC, precision thick film ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder
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16400.

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Open Details in New Window [Jul 22, 2025]

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

8/12 Inch Compatible Low-K Wafer Laser Grooving Equipment for Ltra-Fast UV Picro-Second Laser
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16401.

8/12 Inch Compatible Low-K Wafer Laser Grooving Equipment for Ltra-Fast UV Picro-Second Laser Open Details in New Window [Jul 22, 2025]

Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, manual/auto ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Small Fiber Laser Marking Machine for Sphere and Irregular Surface
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16402.

Small Fiber Laser Marking Machine for Sphere and Irregular Surface Open Details in New Window [Jul 22, 2025]

Small Fiber Laser Marking Machine for Sphere And Irregular Surface Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Infrared/Green/UV Laser Marking Machine for The 6-Inch/ 8-Inch/12-Inch Wafer Marking
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16403.

Infrared/Green/UV Laser Marking Machine for The 6-Inch/ 8-Inch/12-Inch Wafer Marking Open Details in New Window [Jul 22, 2025]

Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

20W Fiber Laser Marking Machine for Stainless Steel/Carbon Steel/Aluminum/Copper
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16404.

20W Fiber Laser Marking Machine for Stainless Steel/Carbon Steel/Aluminum/Copper Open Details in New Window [Jul 22, 2025]

20W Fiber Laser Marking Machine for Stainless Steel/Carbon Steel/Aluminum/Copper Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System
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16405.

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Open Details in New Window [Jul 22, 2025]

Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry
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16406.

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry Open Details in New Window [Jul 22, 2025]

20/30/50W Air Cooling Fiber Laser Marking Machine for Metal Mould Industry Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine
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16407.

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine Open Details in New Window [Jul 22, 2025]

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

6-Inch/8-Inch/12-Inch Wafer Ultra-Fine Engraving UV Fiber Laser Marking Machine
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16408.

6-Inch/8-Inch/12-Inch Wafer Ultra-Fine Engraving UV Fiber Laser Marking Machine Open Details in New Window [Jul 22, 2025]

Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Black Thickness 2 mm Customized High Temperature Resistant Low Light Transmission Quartz Tube ...
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16409.

Black Thickness 2 mm Customized High Temperature Resistant Low Light Transmission Quartz Tube ... Open Details in New Window [Jul 22, 2025]

Product Description Introducing our Custom black Quartz Glass Tube, expertly crafted with High-Quality Fused Silica Glass to meet your advanced needs. 1. Experience the pinnacle of purity with SiO2 concentration ...

Company: JIANGSU HONGYANG QUARTZ PRODUCTS CO.,LTD.

Custom 300mm 400mm 500mm Diameter Transparent Clear Borosilicate Silica Quartz Cylinder Glass ...
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16410.

Custom 300mm 400mm 500mm Diameter Transparent Clear Borosilicate Silica Quartz Cylinder Glass ... Open Details in New Window [Jul 22, 2025]

Product Description Custom Diameter Quartz Glass Tube High Quality Fused Silica Glass Tube 1. High Purity: SiO2 > 99.99%. Experience exceptional purity with our quartz tubes, ensuring the utmost quality in every ...

Company: JIANGSU HONGYANG QUARTZ PRODUCTS CO.,LTD.