Jiangsu Profile
Product List
16681. High Quality Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment 
[Jul 22, 2025]
[Jul 22, 2025] High Quality Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle ...
16682. High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal ... [Jul 22, 2025]
[Jul 22, 2025] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
16683. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing [Jul 22, 2025]
[Jul 22, 2025] Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
16684. Semiconductor Oven Machine Customizable Temperaturehumidity/Vacuum/Cleanliness/Gas Concentratio [Jul 22, 2025]
[Jul 22, 2025] Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
16685. High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment [Jul 22, 2025]
[Jul 22, 2025] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
16686. Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting accuracy Complete ...
16687. UV Laser Cutting Machine with CCD Automatic Positioning Used for FPC/RF/Fpcba/PCBA/Cvl/SIP [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
16688. Precision Cutting/Half Cutting/Trenching Machine of Materials Fpcba/PCBA/RF/Cvl/SIP [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
16689. Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience [Jul 22, 2025]
[Jul 22, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
16690. Manufacture Automatic High Efficiency PCB Board Staggered Cutting Machine with Double Stations [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...
16691. Circuit Boards/Packaging IC Carrier Boardprecision Cutting and Post-Cutting Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting accuracy Complete ...
16692. Glass Cutting & Lobing Machine for Digital 3D Front Andback Cover Glass [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and reliable Self-developed cutting process technology patent, excellent kerf quality, no surface damage High ...
16693. High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine [Jul 22, 2025]
[Jul 22, 2025] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
16694. High Precision Machining and Consistency Wafer Laser Scribing / Cutting Equipment [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and ...
16695. High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire [Jul 22, 2025]
[Jul 22, 2025] Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto detection of marking effects Multi-dust processing,Max. control of particle ...
