Jiangsu Profile

Product List
17371. Mesh Belt Type Rubber Discharge Sintering Furnace for Ceramic Substrate Printing
[Jul 22, 2025]

Product DescriptionThe mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal honeycomb ...
17372. Semiconductor Oven Machine Customizable Temperaturehumidity/Vacuum/Cleanliness/Gas Concentratio
[Jul 22, 2025]

Product Description High temperature vacuum oven Large vacuum drying oven designed for various purposes of vacuum drying. Leave space for installing the vacuum pump. It adopts quick connection flange piping method and ...
17373. High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment
[Jul 22, 2025]

High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
17374. Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine
[Jul 22, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting accuracy Complete ...
17375. UV Laser Cutting Machine with CCD Automatic Positioning Used for FPC/RF/Fpcba/PCBA/Cvl/SIP
[Jul 22, 2025]

Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
17376. Precision Cutting/Half Cutting/Trenching Machine of Materials Fpcba/PCBA/RF/Cvl/SIP
[Jul 22, 2025]

Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
17377. Laser Grooving Cutting Equipment with Humanized Operation Design to Improve User Experience
[Jul 22, 2025]

Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
17378. Manufacture Automatic High Efficiency PCB Board Staggered Cutting Machine with Double Stations
[Jul 22, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...
17379. Automatic Drilling/Cutting/Scribing/Slotting Machine for PCB/FPC/RF/Touch ...
[Jul 22, 2025]

Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...
17380. High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
[Jul 22, 2025]

Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto detection of marking effects Multi-dust processing,Max. control of particle ...
17381. Fully Automatic Loading and Unloading IC Framework Laser Marking Equipment
[Jul 22, 2025]

Product Description Product Features Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection Vision recognizes laser printed 2D codes Automatic generation of Mapping data SECS-GEM ...
17382. Intelligent Recognition Fully Automatic Strip Laser Marking Machine with Automatic ...
[Jul 22, 2025]

Product Description Product Features Dual laser head marking Automatic loading and unloading Various templates for marking, online monitoring of marking quality Offline control mode ensures stability and printing ...
17383. Laser Decapping Machine with Position Preview Function for Packaging & Testing Line
[Jul 22, 2025]

Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser decaping ...
17384. Circuit Boards/Packaging IC Carrier Boardprecision Cutting and Post-Cutting Machine
[Jul 22, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting accuracy Complete ...
17385. Glass Cutting & Lobing Machine for Digital 3D Front Andback Cover Glass
[Jul 22, 2025]

Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and reliable Self-developed cutting process technology patent, excellent kerf quality, no surface damage High ...
