Jiangsu Profile
Product List
18031. Advanced Wafer Tube Cleaning System for Enhanced Production Efficiency 
[Apr 07, 2026]
[Apr 07, 2026] Features •Efficient and energy-saving drying system; •Atmospheric mixed ozone washing,ensure mixing effectiveness; •Cold/hot water slow lift process, wider process window, •Combining efficient filtration with ...
18032. Advanced Fully Automatic Cutting System for Streamlined Production [Apr 07, 2026]
[Apr 07, 2026] Product Description Compact Single-Station Adhesive Film Laying Machine This machine is an advanced, space-efficient solution for automatically cutting and laying adhesive film onto glass or other surfaces. Designed for ...
18033. Durable and Efficient Dispensing Equipment for Manufacturing Needs [Apr 07, 2026]
[Apr 07, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
18034. High-Efficiency Automatic Lead Wedge Welder for Seamless Joints [Apr 07, 2026]
[Apr 07, 2026] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and ...
18035. High-Quality Solder Mask Solutions for Electronics Manufacturing Projects [Apr 07, 2026]
[Apr 07, 2026] Product DescriptionDPS-08 Product advantages the use of multi-band hybrid light source is closer to the mercury lamp spectrum to meet the stringent requirements of special ink curing for carrier boards high production ...
18036. Advanced High Precision Seam Welding Equipment for Industry [Apr 07, 2026]
[Apr 07, 2026] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly reliable ...
18037. High-Precision Laser Drilling Machine with Quick Zoom Feature [Apr 07, 2026]
[Apr 07, 2026] Product DescriptionProduct advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and size ...
18038. Precision Laser Marking Systems for Circuit Packaging Solutions [Apr 07, 2026]
[Apr 07, 2026] UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from ...
18039. High-Precision 3D UV Laser Engraver for Wood and Metal Applications [Apr 07, 2026]
[Apr 07, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...
18040. High-Precision UV and Infrared Laser Marker for Wafers [Apr 07, 2026]
[Apr 07, 2026] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
18041. Advanced Laser Marking System for High-Volume PCBA Manufacturing [Apr 07, 2026]
[Apr 07, 2026] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. Features: ...
18042. Advanced Chip Placement Solutions for Enhanced Manufacturing Productivity [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
18043. Advanced High-Precision Wafer Mounter for Efficient Packaging Solutions [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
18044. Innovative Turret Solutions for Streamlined Chip Management Systems [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test stations,the ...
18045. Precision Modular Wafer Bonding Systems for Advanced Designers [Apr 07, 2026]
[Apr 07, 2026] Modular Bond Chamber Design Automated Wafer Bonding Machine Product Description EVG 501 Wafer Bonding System - Specifications Feature Description Target Application R&D and pilot line production Key Advantage Optimum ...
