Jiangsu Profile
Product List
18136. Advanced High Precision Seam Welding Equipment for Industry 
[Apr 07, 2026]
[Apr 07, 2026] Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This equipment is equipped with a highly reliable ...
18137. High-Precision Laser Drilling Machine with Quick Zoom Feature [Apr 07, 2026]
[Apr 07, 2026] Product DescriptionProduct advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and size ...
18138. Precision Laser Marking Systems for Circuit Packaging Solutions [Apr 07, 2026]
[Apr 07, 2026] UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and unloading from ...
18139. High-Precision 3D UV Laser Engraver for Wood and Metal Applications [Apr 07, 2026]
[Apr 07, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...
18140. High-Precision UV and Infrared Laser Marker for Wafers [Apr 07, 2026]
[Apr 07, 2026] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
18141. Advanced Laser Marking System for High-Volume PCBA Manufacturing [Apr 07, 2026]
[Apr 07, 2026] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. Features: ...
18142. Advanced Chip Placement Solutions for Enhanced Manufacturing Productivity [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
18143. Advanced High-Precision Wafer Mounter for Efficient Packaging Solutions [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin ...
18144. Innovative Turret Solutions for Streamlined Chip Management Systems [Apr 07, 2026]
[Apr 07, 2026] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test stations,the ...
18145. Precision Modular Wafer Bonding Systems for Advanced Designers [Apr 07, 2026]
[Apr 07, 2026] Modular Bond Chamber Design Automated Wafer Bonding Machine Product Description EVG 501 Wafer Bonding System - Specifications Feature Description Target Application R&D and pilot line production Key Advantage Optimum ...
18146. High-Precision Thick Film Furnace for Optimal Temperature Management [Apr 07, 2026]
[Apr 07, 2026] Product Description Category Specification Temperature Range RT (Room Temperature) to 1100°C Temperature Uniformity Better than ±2°C across the furnace Network Belt Speed 20-150 mm/min ...
18147. Precision Laser Grooving Machine for Low-K CMOS Wafers [Apr 07, 2026]
[Apr 07, 2026] Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, which ...
18148. High-Performance 550 °C Ceramic Hot Air Drying Machine [Apr 07, 2026]
[Apr 07, 2026] Product Description Hot air circulation rubber discharge furnace (degreasing furnace) The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding ...
18149. Rapid Heating Furnace Designed for Exceptional Sintering Outcomes [Apr 07, 2026]
[Apr 07, 2026] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
18150. High Temperature Quartz Tube Excellent Thermal Stability & High Transparency [Apr 08, 2026]
[Apr 08, 2026] Company Profile Runlai Quartz Technology Lianyungang Runlai Quartz Technology Co., Ltd. is committed to the R&D, manufacturing and sales of quartz products. We have obtained ISO certification, and are only one hour away ...
