Jiangsu Profile

Product List
19561. Sic Ultra-Thin Wafer Laser Slicing Machine with High Precision Optical Scanning Processing System
[Jul 22, 2025]

Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
19562. Dzx Series Efficient Automation Online Plasma Cleaning Machine
[Jul 22, 2025]

Product Description The equipment can remove the particles on the chips and frameworks according to the lead frame characteristics of IC packaging to improve material surface activity ,advancing wire bonding ...
19563. Factory Wholesale Price Dqx Series Integrated Circuit IC Microwave Plasma Cleaning Machine
[Jul 22, 2025]

Product Description Mainly for the integrated circuit IC packaging process characteristics, remove the chip and frame surface micro-particle pollution and oxide, to improve the surface properties of materials, ...
19564. Semiconductor Copper Layer Electrochemical Stripping System
[Jul 22, 2025]

Corrosion Stripping Copper Equipment refers to industrial systems designed to selectively remove copper layers or corrosion products from substrates through chemical, electrochemical, or plasma-assisted processes. These ...
19565. Hans-F6m Full Linear Motor Six Axis CNC Drilling Machine Used for Drilling Large Quantities of ...
[Jul 22, 2025]

Product Description HANS-F6M Product advantages High speed : XYZ axis full linear motor drive , free maintenance , no wear , efficiency greatly improved High precision : full digital dynamic simulation design of high ...
19566. Mh300 Series CCD Vision Automatic Four-Wire Testing Machine Equipped with One Touch Fixture
[Jul 22, 2025]

Product Description Equipped with One Touch fixture UVW fine tuning platform CCD automatically improves positioning accuracy Four-wire low resistance test to detect all the hole copper missing , micro open ...
19567. Laser IC Marking Equipment with Mes Mark Module System
[Jul 22, 2025]

Laser IC Marking Equipment With MES Mark module system Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of ...
19568. Plasma Treatment System Cleaning Machine
[Jul 22, 2025]

Plasma Treatment System Cleaning Machine Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - ...
19569. Factory Price Vertical Wafer Clean Configuration 12 Inch CMP Device - Horizon300
[Jul 22, 2025]

Product Description 4-Head & 3-Platen polisher; Vertical wafer clean configuration. Integration of multiple advanced endpoint system and a fully precise process control system. Meet CMP process requirements for 28nm ...
19570. High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
[Jul 22, 2025]

High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...
19571. High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine
[Jul 22, 2025]

High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...
19572. Topcon Cell Psg Cleaning Equipment
[Jul 22, 2025]

Features •High precision water-film jet pump, Stepless speed contro •Precision liquid block roller, prevents potion instability; •High-precision anti-corrosion conductivity tester, ...
19573. Tco Rework Sheet Cleaning Equipment
[Jul 22, 2025]

Features • Ozone cleaning process, ozone concentration >40ppm; • Fully automatic production, process formula freely setting • Fully automatic replenishment, One-key wash tank ...
19574. Thin Film Laser Drilling Machine for Various Thin Films Fine Processing (precision drilling of PE ...
[Jul 22, 2025]

Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
19575. Long Life Fiber Laser High-Speed Marking Equipment for Various Discrete Devices
[Jul 22, 2025]

Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...
