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Product List
20191. High-Precision CO2 Laser Engraver for Custom Fabric Art 
[May 11, 2026]
[May 11, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
20192. High Precision COB Die Bonding Machine for Electronics Production [May 11, 2026]
[May 11, 2026] Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ...
20193. Advanced Solidifying Patch Solutions for Streamlined Production Lines [May 11, 2026]
[May 11, 2026] High-Precision Die Bonder Integrated Multi-Functional Patch Solidifying Machine Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and ...
20194. High-Temperature Electric Furnace with Innovative 5g Ceramic Filter [May 11, 2026]
[May 11, 2026] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
20195. Advanced High-Precision Laser Drilling Machine with Quick Zoom Technology [May 11, 2026]
[May 11, 2026] Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...
20196. Reliable Laser Marking Equipment for Circuit Packaging Needs [May 11, 2026]
[May 11, 2026] UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. Fully-automatic loading and ...
20197. High-Precision 3D UV Laser Engraving Machine for Wood and Metal [May 11, 2026]
[May 11, 2026] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
20198. Innovative Marking Systems for Efficient PCBA and IC Production [May 11, 2026]
[May 11, 2026] PCBA & IC & Wafer Marking Machine for Digital Products/ Automobile/Mobile Phone PCBA/ FPC Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone ...
20199. High-Precision UV and Infrared Laser Marker for Semiconductor Wafers [May 11, 2026]
[May 11, 2026] Product Description Brief Description Applicable for the 6-inch, 8-inch and 12-inch wafer marking Features: 1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking. 2. ...
20200. Efficient Laser Engraving System for Large-Scale PCBA Manufacturing [May 11, 2026]
[May 11, 2026] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...
20201. Advanced Wafer Stacking Technology for High-Precision Die Bonding [May 11, 2026]
[May 11, 2026] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
20202. Precision Chip Placement Systems for Optimized Manufacturing Efficiency [May 11, 2026]
[May 11, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
20203. Advanced Wafer Mounter for Optimal Packaging Solutions Worldwide [May 11, 2026]
[May 11, 2026] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
20204. Advanced Qfn Testing and Sorting Machine for Efficient Packaging [May 11, 2026]
[May 11, 2026] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
20205. Advanced Turret Solutions for Efficient Chip Management Systems [May 11, 2026]
[May 11, 2026] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test stations,the ...
