Jiangsu Profile
Product List
20386. High Efficiency Automatic Dispenser Machine for OEM Applications 
[Feb 28, 2026]
[Feb 28, 2026] Manufacturer OEM Customized High Efficiency dispenser device Fully Automatic Dispensing Machine Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning ...
20387. Precision UV Laser Cutter for Flexible Pcbs and Fpcs [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
20388. Advanced Fully Automatic Wafer Marking Machine for 2D and 1d Codes [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Marking Equipment Suitable for Marking 2D Codes/One-Dimensional Codes Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...
20389. High-Power 10W/15W/25W UV Laser Engraving Machine for Wood and Metal [Feb 28, 2026]
[Feb 28, 2026] 4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. ...
20390. Precision Automatic Silicone Glue Dispenser for Efficient Bonding [Feb 28, 2026]
[Feb 28, 2026] Hot Melt Adhesive Silicone manufactured equipment coating Glue Automatic Desktop Dispenser Machine Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
20391. High-Precision UV Laser Cutting Machine for Wafer Production [Feb 28, 2026]
[Feb 28, 2026] High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
20392. Precision Laser Debonding and Stripping Equipment for Professionals [Feb 28, 2026]
[Feb 28, 2026] Automatic Compensation Laser Debonding/Stripping Machine Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding efficiency and low thermal ...
20393. High-Performance Flip Chip Die Bonder for Semiconductor Efficiency [Feb 28, 2026]
[Feb 28, 2026] Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Category Specification Model SHD8120 Loading Method Wafer stacking and tray Bonding Method Epoxy Bonding Precision X/Y ≤ ...
20394. High-Performance Modular Laser Annealing System for Sic Applications [Feb 28, 2026]
[Feb 28, 2026] Hot Selling Modular Design and Integration Laser Annealing Machine for Sic Product Description Laser Annealing Machine for Sic Equipment features: 1. Modular design and integration of the entire machine, ...
20395. Ldi - M30 Series Direct Imaging System Wet Film Exposure for Inner Circuit [Feb 28, 2026]
[Feb 28, 2026] Product DescriptionProduct features and advantages: Deep cultivation of inner wet film field , special wet film processing efficiency breakthrough , up to 10500 panels / day With high quality and high power composite ...
20396. Advanced Metal Fiber Laser Marking Machine for Precision Engraving [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
20397. Precision Fiber Laser Engraving Machine for Curved Surfaces [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch ...
20398. High-Precision UV Laser Marking Machine for Mobile Phone PCB [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on. Marking on the Rigid and flexible printed circuit board ...
20399. Advanced Laser Epitaxy System with Precision Beam Control [Feb 28, 2026]
[Feb 28, 2026] Laser Induced Epitaxial Growth Machine with Beam Combination Technology and Modulation Technology Product Description Product Features First domestic 12 inch mass production equipment High precise beam combination ...
20400. 120kN Anti-Pollution Toughened Glass Insulator U120BL for Overhead Transmission Line [Feb 28, 2026]
[Feb 28, 2026] Product Description U70BLP Glass Insulator 1.NJREC glass suspension insulators are designed, manufactured and tested in conformance with the requirements of ANSI Standard C.29.2B. 2.We produce standard type glass ...
Company: Nanjing Rainbow Electric Co., Ltd.
