Jiangsu Profile
Product List
23716. High-Efficiency Laser Sealing and Decapping Machine for Production 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser decaping ...
23717. Cutting-Edge Ultra Low Temperature Plasma Cleaner for Superior Surface Treatment [Feb 28, 2026]
[Feb 28, 2026] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine ...
23718. Ultra-Fast Picosecond Laser Cutting Machine for Precision Glass [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and reliable Self-developed cutting process technology patent, excellent kerf quality, no surface damage High ...
23719. Precision Wafer Laser Scribing and Cutting Machine for Diverse Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and ...
23720. Smart Fully Automated Bagging Machine for Efficient Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description Scope of application The new bagging machine is a new product developed by our company. The new bagging machine can effectively solve the packaging needs of automatic bagging of products containing ...
23721. High-Precision Linear Die Bonder for Superior Bonding Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
23722. Advanced Wafer Back Grinding System with Smart Scanning Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling robot Equipped with Fool-proofing system to identify the positive and ...
23723. Next-Gen Automated Plasma Cleaning Machine with Conveyor System [Feb 28, 2026]
[Feb 28, 2026] Product Description Product features: 1. WINDOWS operating system - Use computer + motion controller, fault sound and light alarm and menu display; 2. Drived by stepping motor and synchronous belt; 3. Equipped ...
23724. Advanced Zeolite Concentrator for Efficient Spray Painting Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description 1,Scope of application The organic waste gas flow rate is higher than 10000 Nm3/h; Concentration 300-1500 mg/m3; Subsequent direct combustion furnace, RTO or CO treatment are suitable for ...
23725. Ultimate Precision Electronic Device Cleaning Kit for All Screens [Feb 28, 2026]
[Feb 28, 2026] Product Description 1,Scope of application Ultrasonic cleaning machine, continuous cleaning equipment, PCB cleaning equipment. 2,application area It is applied to electronic devices, packaging shells, circuit boards, ...
23726. Advanced Electroplating Equipment for Flawless Cleaning and Etching [Feb 28, 2026]
[Feb 28, 2026] Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated waste gas treatment device, precious metal recovery device, "zero discharge" system for wastewater reuse, ...
23727. Innovative Waste Gas Treatment Solutions for Advanced Tail Gas Management [Feb 28, 2026]
[Feb 28, 2026] Product Description 1,Scope of application It is used for front-end pretreatment in the tail gas treatment process to ensure the stability of the subsequent core processing equipment and improve the life of the core ...
23728. High-Precision Flip-Chip Die Attach Machine for Efficient Mounter [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
23729. Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function [Feb 28, 2026]
[Feb 28, 2026] Desktop Automatic Glue Dispensing Machine semiconductor Dispenser device with Visual Function Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS ...
23730. Automatic Drilling/Cutting/Scribing/Slotting Machine for PCB/FPC/RF/Touch ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...
