Jiangsu Profile
Famous Export Brand
Product List
36796. Precision Cutting and Trenching Machine for Fpcba and PCBA 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
36797. Advanced Grinding Machine for Hard and Brittle Materials [Feb 28, 2026]
[Feb 28, 2026] Advantages (1) R400 series of machines have been designed to take advantage of state-of-the-art grinding technologies and ergonomics. (2) The fully encapsulated grinding area offers optimum environmental conditions for ...
36798. High-Precision Fiber Laser Engraving Machine for PCB Applications [Feb 28, 2026]
[Feb 28, 2026] Fiber laser marking system A fiber laser marking machine is a high-precision industrial tool that uses a focused fiber laser beam to etch or engrave permanent marks on materials. Unlike traditional methods (ink ...
36799. Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace [Feb 28, 2026]
[Feb 28, 2026] Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...
36800. Advanced Continuous Push Plate Furnace for Electronic Sintering [Feb 28, 2026]
[Feb 28, 2026] Product Description As a continuous production equipment, the push plate furnace is suitable for the discharge and sintering of various molding processes such as injection, casting, dry pressing, isostatic pressing, ...
36801. High Efficiency Precision Die Bonding Machine for Chips [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
36802. High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
36803. Ultra-Precision Optical Lens for Superior Wafer Bonding Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...
36804. Advanced Fiber Laser Cutting Machine with Dual Drive Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...
36805. High-Precision 20W Desktop Metal Laser Engraver for Art Projects [Feb 28, 2026]
[Feb 28, 2026] 20W Desktop Air Cooling Metal Laser Engraving Machine Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high ...
36806. High-Precision Air Cooling CO2 Laser Marking Machine for Diverse Materials [Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, food packaging, electronic components, PCB bar codes, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and ...
36807. Djj-120 Automatic Chamfering Machine for Semiconductor Wafer [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering Machine In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high ...
36808. Advanced High Precision Eutectic Wafer Bonder for Die Attachment [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
36809. High-Precision Ceramic Cutting and Drilling Machine for Professionals [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
36810. Versatile Kiln for Advanced Ceramic Fiber and High Heat [Feb 28, 2026]
[Feb 28, 2026] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
