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Low Thermal Expansion Polyimide Sheet for Precision Instruments
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6196.

Low Thermal Expansion Polyimide Sheet for Precision Instruments Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM Polyimide Mechanical properties Tensile strength MPa D638 86 Tensile elongation % D638 7.5 Tensile Modulus Mpa ISO 527-2 3275 Flexural Modulus Mpa ISO 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

High-Purity Long-Lasting Alumina Oxide Ceramic Ball for Pigment Milling with Efficient ...
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6197.

High-Purity Long-Lasting Alumina Oxide Ceramic Ball for Pigment Milling with Efficient ... Open Details in New Window [Sep 20, 2026]

Product Introduction Alumina Oxide Ball Our alumina balls are a premium ceramic grinding media engineered for high hardness, superior density, exceptional wear resistance, and minimal wear loss. These high-quality ...

Company: Lianyungang Zhongyun Aluminum New Materials Co., Ltd.

High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions
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6198.

High-Precision Automatic Die Bonder for Efficient LED Packaging Solutions Open Details in New Window [Sep 16, 2026]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Glass Filled Polyimide Sheet for High Rigidity Applications
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6199.

Glass Filled Polyimide Sheet for High Rigidity Applications Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM Polyimide Mechanical properties Tensile strength MPa D638 86 Tensile elongation % D638 7.5 Tensile Modulus Mpa ISO 527-2 3275 Flexural Modulus Mpa ISO 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

Factory Custom Conductive Peek Sheet for EMI Shielding
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6200.

Factory Custom Conductive Peek Sheet for EMI Shielding Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

High Temperature Peek Plate for Oil and Gas Industry
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6201.

High Temperature Peek Plate for Oil and Gas Industry Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

Thermally Conductive Peek Sheet for Heat Management
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6202.

Thermally Conductive Peek Sheet for Heat Management Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

High-Speed Fiber Laser Engraver for Creative Design Projects
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6203.

High-Speed Fiber Laser Engraver for Creative Design Projects Open Details in New Window [Sep 17, 2026]

Product Description Product Features Structure: One-piece, split, vertical, horizontal, etc., for all testers High Reliability, long life fiber laser Max. UPH up to 60K Offline control mode,good ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Die Bonding Equipment for Advanced Eutectic Applications
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6204.

Precision Die Bonding Equipment for Advanced Eutectic Applications Open Details in New Window [Sep 17, 2026]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Wafer Bonder for Advanced Chip Assembly Solutions
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6205.

High-Precision Wafer Bonder for Advanced Chip Assembly Solutions Open Details in New Window [Sep 17, 2026]

Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y &plusmn;0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Dielectric Peek Bar for High Voltage Electrical Insulation
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6206.

High Dielectric Peek Bar for High Voltage Electrical Insulation Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

Factory Direct Sales Bushing Peek Sheet for Heavy Machinery
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6207.

Factory Direct Sales Bushing Peek Sheet for Heavy Machinery Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

Custom Fatigue Resistant Peek Sheet for Cyclic Loading
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6208.

Custom Fatigue Resistant Peek Sheet for Cyclic Loading Open Details in New Window [Sep 21, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.

Carbon Fiber Stainless Steel HDPE Epoxy Doctor Blade Used for Press Roll
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6209.

Carbon Fiber Stainless Steel HDPE Epoxy Doctor Blade Used for Press Roll Open Details in New Window [Sep 20, 2026]

Sun Hong Doctor Blades for Efficient and Stable Paper Machine Operation Paper machine doctor blade is a scraping tool used to remove pulp and impurities on the surface of paper machine rollers and dryer cylinders. It is ...

Company: SUN HONG PAPER TECH XUZHOU LTD

Direct From Factory Medical Grade Peek Rod for Medical Devices
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6210.

Direct From Factory Medical Grade Peek Rod for Medical Devices Open Details in New Window [Sep 20, 2026]

Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...

Company: Suzhou Dotmar Engineering Plastics Co., Ltd.