Jiangsu Profile
Product List
11791. Ultimate Silicone Dispensing System for Effortless Product Application 
[May 11, 2026]
[May 11, 2026] High Precision Cost-Efficient Automatic Silicone Dispensing Equipment Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD ...
11792. Superior Plasma Cleaning Solutions for Precision Semiconductor Care [May 11, 2026]
[May 11, 2026] Product Description 1. Stainless steel of the vacuum chamber; 2. Ultra low temperature - The temperature is as low as 40 ºC; 3. Omnidirectional surface cleaning - Different plasma can enter the ultra-fine slit for ...
11793. High-Precision Laser Systems for Silicon Carbide Wafer Processing [May 11, 2026]
[May 11, 2026] Customization Silicon Carbide Wafer Laser Processing machine factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD ...
11794. High Precision Industrial Wafer Grinding Machine for Optimal Performance [May 11, 2026]
[May 11, 2026] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding ...
11795. Advanced Precision Wire Bonding Solutions for Enhanced Production Efficiency [May 11, 2026]
[May 11, 2026] High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...
11796. Advanced Laser Cutter for Professional Marble and Stone Engraving [May 11, 2026]
[May 11, 2026] High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super ...
11797. Automated Width Control Laser System for Wafer Grooving [May 11, 2026]
[May 11, 2026] High Quality Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results ...
11798. High-Performance Vertical Furnace for Efficient Pi Cuer Annealing [May 11, 2026]
[May 11, 2026] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, ...
11799. High-Precision Laser Cutting System for FPCB Manufacturing Excellence [May 11, 2026]
[May 11, 2026] High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, circuit board ...
11800. Advanced Fmj Industrial Furnace for Extreme Heat Processing [May 11, 2026]
[May 11, 2026] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
11801. Precision Laser Engraving Machine for PCB Production Efficiency [May 11, 2026]
[May 11, 2026] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...
11802. Advanced Sic Chip Wafer Splitting Equipment with CCD Technology [May 11, 2026]
[May 11, 2026] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
11803. Advanced Subsurface Laser Dicing Machine for Semiconductor Wafers [May 11, 2026]
[May 11, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
11804. Precision Spray Control System for Enhanced Painting Efficiency [May 11, 2026]
[May 11, 2026] Vocs Catalytic Combustion for Spray Painting machine glue Coating Rotary Printing Chemical Production industrial equipment Product Description 1,Scope of application The organic waste gas flow rate is 1000 ...
11805. High-Precision Laser Marking Machine for Mobile PCB Engraving [May 11, 2026]
[May 11, 2026] High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer ...
