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Product List
12766. Soil Moisture Tensiometer Ceramic Probe Porous Ceramic Probe Cup Ceramic Cups for Soil Tensiometer 
[Mar 17, 2026]
[Mar 17, 2026] Product Description Product Name Irrigation porou ceramic tube Material ceramics Color white Payment T/T,Western Union,Online payment by credit card are available Application It is widely used for ...
12767. Transcend Tmp 1HP-5HP Horizontal Fluoroplastic Chemical Centrifugal Pump for Sulphuric Acid Pump ... [Apr 02, 2026]
[Apr 02, 2026] Features Corrosion-resistant and High-temperature Resistant 1. Magnetic drive, no shaft seal design, completely leak-proof, preventing chemical liquid leakage and environmental pollution. 2. Suitable for the transfer of ...
Company: BSD Machinery Co., Ltd.
12768. 201 Stainless Steel Salt Mill 200ml with Ceramic Grinding Core Durability [Mar 04, 2026]
[Mar 04, 2026] Product Name 201 stainless steel high model grinder (200ml Capacity specification 200ml Box size 80Pieces Packing size (cm) 55*35*40cm Weight (kg) 19kg FAQ 1.How can i get quote from you? We have good solutions to meet ...
12769. 201 Stainless Steel Grinder 200ml with Durable Ceramic Rotor Inside [Mar 04, 2026]
[Mar 04, 2026] Product Name 201 stainless steel high model grinder (200ml Capacity specification 200ml Box size 80Pieces Packing size (cm) 55*35*40cm Weight (kg) 19kg FAQ 1.How can i get quote from you? We have good solutions to meet ...
12770. 201 Stainless Steel Pepper Grinder 200ml with Ceramic Grinding Mechanism Inside [Mar 04, 2026]
[Mar 04, 2026] Product Name 201 stainless steel high model grinder (200ml Capacity specification 200ml Box size 80Pieces Packing size (cm) 55*35*40cm Weight (kg) 19kg FAQ 1.How can i get quote from you? We have good solutions to meet ...
12771. China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...
12772. Advanced Automated Back Grinding Machine for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating Product Description Equipment Advantage Equipped with material information scanning and input ...
12773. Advanced High Precision Die Bonder for Semiconductor Packaging [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
12774. Advanced Precision Wafer Die Bonder with Smart Control Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
12775. Advanced Precision Eutectic Die Bonding Equipment for High-Quality Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds ...
12776. Advanced Automatic High Precision Die Bonder for Qfp/Lqfp/Qfn [Feb 28, 2026]
[Feb 28, 2026] Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...
12777. China Big Hydraulic Chlorine Rotary Tablet Press Machine [Feb 28, 2026]
[Feb 28, 2026] Food: Candy /coffee, chocolate, flavored pieces, chicken pieces, glucose blocks; Agriculture: Feed block, fertilizer tablets, animal food, plant ground block; Electronic Battery: Thermistor, IC components, ...
12778. Customized Mold Silicone Rubber Products Processing Silastic Ultra-Soft Paiting Board [Feb 26, 2026]
[Feb 26, 2026] Customizable dimensions and colors. Colors can be adjusted according to customers' requirements. Resistance to high and low temperature-80 °C to 250 °C Product Description Customization and mold - opening ...
12779. Factory Price 4 Deck 8 Trays Bakery Oven Custom Bread Cake Deck Oven Commercial Baking Oven Machine ... [Feb 26, 2026]
[Feb 26, 2026] Product Description Application of the Oven An electric deck oven utilizes controllable electric heating to achieve uniform heat distribution and stable temperature within an enclosed chamber, ensuring dough and other ...
12780. Low MOQ Industrial Commercial Bakery Oven Equipment Bakery Deck Oven 4 Deck 8 Trays Gas Electric ... [Feb 26, 2026]
[Feb 26, 2026] Product Description Application of the Oven An electric deck oven utilizes controllable electric heating to achieve uniform heat distribution and stable temperature within an enclosed chamber, ensuring dough and other ...
