Jiangsu Profile
Product List
14521. High Precision Die Bonding Machine for PCB and IC Assembly 
[Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
14522. High-Precision Automatic Die Bonding Equipment for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die ...
14523. Advanced Laser Marking System for Precision Wafer Solutions [Feb 28, 2026]
[Feb 28, 2026] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
14524. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
14525. Advanced CCD Glue Dispensing Robot for Industrial Applications [Feb 28, 2026]
[Feb 28, 2026] Automatic Desktop Dispensing Robot Vision Glue Dispensing Machine CCD Visual Positioning equipment Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
14526. Precision Desktop Liquid Gluing Dispensing System Potting Machine for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Industrial Dispensing machine Desktop Robot Glue coating Dispenser device producer Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 ...
14527. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
14528. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
14529. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
14530. Automatic High Speed Epoxy Die Bonder Machine Manufacturer [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Ultra High-Speed Silver Paste Die Bonder Unmatched Speed and Precision for Modern Semiconductor Assembly Introducing our fully automatic ...
14531. Advanced 355nm UV Laser Marking Machine for Precision Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Overview: Precision UV Laser Marking Machine Elevate your production line with our high-precision UV Laser Marking Machine. Designed for flawless, permanent marking on sensitive and ...
14532. Precision Automatic CCD Visual Glue Dispenser for Efficient Bonding [Feb 28, 2026]
[Feb 28, 2026] Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning ...
14533. Precision Laser Cutting Equipment for Superior Grooving Performance [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
14534. High-Precision Tgv Laser Drilling System for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Tgv High-End Precision Laser Drilling Machine Tgv industrial equipment factory supplier Product Description New Fully Automated Dual-Station Laser Cutter Sets Benchmark for Brittle Material Processing We are pleased to ...
14535. Advanced UV Laser Annealing Equipment for Bsi CCD Fabrication [Feb 28, 2026]
[Feb 28, 2026] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly ...
