Jiangsu Profile
Product List
1951. Excellent Drilling Ability Electrical Insulation Epoxy Polyurethane and Silicone Compounds 
[Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1952. Good Adhesion to Metals Plastics Protect Sensitive Components Silicone Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1953. Flexible Enhanced Mechanical Strength Vibration Resistance Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1954. Precision Bonding Chemical Protection Potting Compound No Harm environment [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1955. Long-Lasting Insulation Shock Resistance Electronic Potting Compound Epoxy Gel [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1956. Industrial-Grade Corrosion Protection Electronics Silicone Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1957. Heat-Resistant Against Moisture High Thermal Conductivity Epoxy Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1958. Excellent Thermal Conductivity Prevent Overheating Components and Motors Compound Potting [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1959. Protective Barrier Around High-Heat Electrical Appliances Aging Resistance Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1960. Excellent Thermal Conductivity and Aging Resistance Vs-Tp2001 Fixation Potting and Encapsulation ... [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1961. Thoughtful Instruction Printed Circuit Boards Potting Compound Thermally Conductive [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1962. Low Viscosity Excluding Moisture and Corrosive Agents Electronics Stanility Potting Compound [Dec 19, 2024]
[Dec 19, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1963. PCB Application Two Component Thermal Conductive Silicone Potting Compound [Nov 29, 2024]
[Nov 29, 2024] Product Description VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material that ...
1964. Low Viscosity Self-Leveling Electronic Products Vs-Tp0501 Thermally Conductive Potting Compound [Nov 29, 2024]
[Nov 29, 2024] Product Description VS-TP0501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP0501 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material ...
1965. 2.0 W/M K Thermal Conductivity PCB Thermal Conductive Silicone Gel Potting Compound [Nov 29, 2024]
[Nov 29, 2024] Product Description VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material that ...
