Jiangsu Profile
Famous Export Brand
Product List
15391. Lb-a Type Lever Blocks Made in China with Ce 
[Nov 19, 2019]
[Nov 19, 2019] Lever block, ler hoist, Manual hoist Capacity: From 0.25T to 9T Technical Features: Super Grade100 load chain-Wafios link, DIN standard. Forged and Heat Treated load Hooks with batch traceability and stretch ...
Company: Jiali Machinery Co., Ltd.
15392. Manual Chain Hoist with Various Capacity Made in China [Nov 19, 2019]
[Nov 19, 2019] Lever block, ler hoist, Manual hoist Capacity: From 0.25T to 9T Technical Features: Super Grade100 load chain-Wafios link, DIN standard. Forged and Heat Treated load Hooks with batch traceability and stretch ...
Company: Jiali Machinery Co., Ltd.
15393. Low Headroom Type Electric Chain Hoist [Nov 05, 2018]
[Nov 05, 2018] Low Headroom Hoists Specifications: TXK low headroom eletric chain hoist ( 500kg -10T ) is uniquely designed to have shorter headroom than that of standard hoist configurations. This product is the most suitable ...
Company: Jiali Machinery Co., Ltd.
15394. Advanced Gear Grinding Machine for Optimal Production Performance [Jul 09, 2026]
[Jul 09, 2026] Machine Introduction The YKG73100 CNC gear grinding machine adopts the form-generating method to grind involute cylindrical gears. It is a new - generation medium - grade specification high - precision formed ...
Company: U·BRIGHT SOLUTIONS Co., Ltd.
15395. Automatic Grinding CNC External Grinding Machine Tool Mk1332 [Jul 09, 2026]
[Jul 09, 2026] Hot sale product MK1332 Cylindrical grinder / Siemens 828D NC system / external grinding / THK BALL SCREW /
Company: WUXI CHANGYI MACHINE TOOL CO., LTD.
15396. CNC External Grinding Machinery Mk1332 Max. Od 400mm, Max. Length 1500mm [Jul 09, 2026]
[Jul 09, 2026] Hot sale product MK1332 Cylindrical grinder / Siemens 828D NC system / external grinding / THK BALL SCREW /
Company: WUXI CHANGYI MACHINE TOOL CO., LTD.
15397. Powder Metallurgy CNC Internal Grinding Machine Tool Mk2110 [Jun 29, 2026]
[Jun 29, 2026] * Main characteristics of this machine tool * This machine tool is mainly used for grinding internal hole, internal end face, external end face and stepped hole of work piece. * Setting and adjustment of machine tool ...
Company: WUXI CHANGYI MACHINE TOOL CO., LTD.
15398. Silicon Wafer Double Side Grinding Machine for IC Wafer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15399. Semiconductor Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15400. IC Silicon Wafer Thinning Machine High Precision [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15401. Semiconductor Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15402. Silicon Wafer Thinning Machine for Microelectronics [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15403. Semiconductor Wafer Double Side Lapping Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15404. Silicon Wafer Double Side Grinding Machine for IC Manufacturing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
15405. Semiconductor Silicon Wafer Thinning Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
