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Sg 650 Circular Band Saw Blade Sharpening Machine
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11476.

Sg 650 Circular Band Saw Blade Sharpening Machine Open Details in New Window [Jan 28, 2021]

Item Name Data 1 Saw blade outer diameter Φ50mm-Φ650mm 2 the teeth distance 25mm 3 teeth depth 8mm 4 cutting degree -5°- 30° 5 feeding speed 45-180 teeth/ minute 6 saw blade ...

Company: Zhangjiagang Baorui Machinery Co., Ltd.

Automatic Grinding CNC External Grinding Machine Tool Mk1332
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11477.

Automatic Grinding CNC External Grinding Machine Tool Mk1332 Open Details in New Window [Jul 09, 2026]

Hot sale product MK1332 Cylindrical grinder / Siemens 828D NC system / external grinding / THK BALL SCREW /

Company: WUXI CHANGYI MACHINE TOOL CO., LTD.

CNC External Grinding Machinery Mk1332 Max. Od 400mm, Max. Length 1500mm
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11478.

CNC External Grinding Machinery Mk1332 Max. Od 400mm, Max. Length 1500mm Open Details in New Window [Jul 09, 2026]

Hot sale product MK1332 Cylindrical grinder / Siemens 828D NC system / external grinding / THK BALL SCREW /

Company: WUXI CHANGYI MACHINE TOOL CO., LTD.

Semiconductor Wafer Double Side Polishing Machine
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11479.

Semiconductor Wafer Double Side Polishing Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Thinning Machine High Precision
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11480.

IC Silicon Wafer Thinning Machine High Precision Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Grinding Equipment
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11481.

Semiconductor Silicon Wafer Double Side Grinding Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Thinning Machine for Microelectronics
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11482.

Silicon Wafer Thinning Machine for Microelectronics Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Double Side Lapping Equipment
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11483.

Semiconductor Wafer Double Side Lapping Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Thinning Equipment
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11484.

Semiconductor Silicon Wafer Thinning Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Wafer Double Side Lapping Machine High Accuracy
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11485.

IC Wafer Double Side Lapping Machine High Accuracy Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Thinning Machine for Semiconductor Industry
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11486.

Silicon Wafer Thinning Machine for Semiconductor Industry Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Double Side Lapping Machine for IC Processing
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11487.

Semiconductor Wafer Double Side Lapping Machine for IC Processing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Double Side Grinding Equipment
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11488.

IC Silicon Wafer Double Side Grinding Equipment Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Double Side Polishing Machine
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11489.

Semiconductor Silicon Wafer Double Side Polishing Machine Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Thinning Machine High Precision
Contact Now

11490.

Semiconductor Silicon Wafer Thinning Machine High Precision Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.