Jiangsu Profile
Product List
9136. Wafer Automatic Transfer System Solution Equipment Factory 
[Dec 13, 2025]
[Dec 13, 2025] Product Description The Wafer Automatic Transfer System is a precision robotic manipulator designed for semiconductor manufacturing, wafer handling, and vacuum process automation. It ensures high-speed, high-precision, ...
9137. Advanced Efficiency Bonder for Precision Semiconductor Wire Bonder Packaging Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...
9138. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
9139. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Dec 13, 2025]
[Dec 13, 2025] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
9140. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
9141. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
9142. Manual Semi Automatic Aluminum or Gold Desktop Wire Bonders with Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
9143. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
9144. Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
9145. Advanced Microwave Bonding Machines with Precision Automation Features [Dec 13, 2025]
[Dec 13, 2025] Product Description Fully Automatic Lead Wire Bonding Machine for Microwave Hybrid Assembly This fully automatic lead wire bonding machine is a critical piece of process equipment designed for the high-volume ...
9146. High Efficiency Bonder Wire Bonding Bonder Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description Packaging and delivery Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave ...
9147. Automatic Glass Bottle Pure Mineral Drinking Water Bottling Filling Capping Machine [Dec 12, 2025]
[Dec 12, 2025] Product Description Automatic glass bottle drinking water bottling filling capping machine BCGF series of glass bottled water filling machine, it is a monoblock unit, integrated with washing filling and capping ...
9148. Automatic Factory Price Pure Mineral Water Glass Bottle Filling Capping Machine [Dec 12, 2025]
[Dec 12, 2025] Product Description Automatic Factory Price Pure Mineral Water Glass Bottle Filling Capping Machine BCGF series of glass bottled water filling machine, it is a monoblock unit, integrated with washing filling and ...
9149. Automatic Drinking Pure Water Bottling Filling Capping Production Line Machine [Dec 10, 2025]
[Dec 10, 2025] Product Description Automatic Best price drinking pure Water processing Bottling filling Capping packaging plant production line Machine BCGF series of glass bottled water filling machine, it is a monoblock unit, ...
9150. Complete Automatic Glass Water Bottle Filling Bottling Capping Packing Machine [Dec 10, 2025]
[Dec 10, 2025] Product Description Complete automatic glass water bottle filling bottling capping packing machine BCGF series of glass bottled water filling machine, it is a monoblock unit, integrated with washing filling and ...
