Jiangsu Profile
Product List
12961. S&a Laser Chiller for Cutting 4000W 
[Nov 18, 2025]
[Nov 18, 2025] Product Description S&A Laser Chiller for Cutting 4000W The S&A Laser Chiller for Cutting 4000W is a high-precision industrial water cooling system designed specifically to maintain optimal operating temperatures for ...
12962. Hanli Laser Chiller 60Hz 3-6kw [Nov 18, 2025]
[Nov 18, 2025] Product Description HANLI Laser Chiller The HANLI HL-EH-QG2/2 3000W-6000W series represents a line of high-capacity industrial laser chillers engineered for precision thermal management in demanding industrial ...
12963. Hanli Laser Water Chiller 50Hz 3-6kw [Nov 18, 2025]
[Nov 18, 2025] Product Description HANLI Laser Chiller The HANLI HL series represents a line of high-capacity industrial laser chillers engineered for precision thermal management in demanding industrial applications. These ...
12964. C10400 C1040 Silver-Copper Alloy Rod [Oct 24, 2025]
[Oct 24, 2025] C10400 C1040 silver-copper alloy rod Product description: High hardness, high conductivity, high softening bronze strip produced by Powerway Alloy have excellent cold working, moderate strength, high ...
Company: Wuxi Taixie Metal Material Co., Ltd.
12965. Infrared Laser Drone Gimbal Thermal Camera for Reconnaissance and Tracking Drone Camera [Nov 18, 2025]
[Nov 18, 2025] LT-CUAS35UC-C1 Electro-Optical Turret features integrated multispectral imaging, which combines visible light, infrared, and laser payloads to provide day-and-night reconnaissance, tracking, AI recognition for objects ...
12966. 500W Compact Solar Power System MPPT Control, CE Approved for RV and Marine Use [Nov 17, 2025]
[Nov 17, 2025] Product Features 1.All in one design: inverter, controller and battery all built-in, easy to use and install. 2.Continuous stable pure sine wave: no loss to load. 3.Hybrid mode: can be charged by solar as well as grid, ...
12967. High Precision Automatic Lead Wire Bonding Machinery for Electronics [Dec 01, 2025]
[Dec 01, 2025] High quality Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase ...
12968. New Nuolikai PE Carton Customized Jiangsu, China Pressure Odorless Shock Resistant Mailer [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12969. Art & Craft Drugs Nuolikai Carton Jiangsu, China Packaged Express Customized [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12970. Carton Household Appliances Nuolikai Customized Jiangsu, China Inflatable Bag Mailer [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12971. Buffer and Shock Absorption Food Nuolikai Carton Bag Bubble Mailer [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12972. PE Art & Craft Nuolikai Carton Customized Jiangsu, China Bubble Mailer [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12973. Cosmetics PE Nuolikai Carton Customized Air Cushion Film Bubble Mailer [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12974. Food Household Appliances Nuolikai Carton Air Column Roll Bubble Pad [Oct 30, 2025]
[Oct 30, 2025] Product Description Overview Basic Info. Product Name Bubble film Material PE Model NO. Customized Inflation method Professional Machine ...
12975. Fully Automatic Vertical Furnace for Quick Thermal Processing [Dec 05, 2025]
[Dec 05, 2025] Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, fingerprint recognition; rapid annealing of integrated circuit wafers. Features: ...
