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Precision Laser Marking Solutions for High-Quality PCB Production Systems
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16591.

Precision Laser Marking Solutions for High-Quality PCB Production Systems Open Details in New Window [Oct 26, 2026]

High Efficiency Fully Automatic Dedicated Laser Precision Marking Equipment Product Description Automated PCB Laser Marking System Precision Marking for Electronics Manufacturing Our PCB Laser Marking Systems ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Processing Tool with 15W UV Laser Dicing
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16592.

High Precision Wafer Processing Tool with 15W UV Laser Dicing Open Details in New Window [Oct 26, 2026]

Product Description Product Overview The KY-C-UC15-P3040 is a high-precision UV laser processing system designed for cutting and dicing wafers up to 6 inches in diameter. Utilizing a DPSS ultraviolet laser source ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Reliable Laser Marking Systems for Efficient Wafer Manufacturing Equipment
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16593.

Reliable Laser Marking Systems for Efficient Wafer Manufacturing Equipment Open Details in New Window [Oct 26, 2026]

Product Description Fully Automatic Wafer DIE Laser Marking System: The Future of Semiconductor Marking Introduction The Fully Automatic Wafer DIE Laser Marking System is a cutting-edge semiconductor marking technology ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Qr Code Marking System for Semiconductor Wafer Identification
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16594.

Advanced Qr Code Marking System for Semiconductor Wafer Identification Open Details in New Window [Oct 26, 2026]

Product Description DSI-G-WMN6021-A Fully Automatic Wafer ID Marking Equipment The DSI-G-WMN6021-A is a state-of-the-art, fully automatic system designed for high-precision and high-throughput permanent marking on a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Drilling Equipment for Enhanced Production Efficiency and Precision
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16595.

Advanced Laser Drilling Equipment for Enhanced Production Efficiency and Precision Open Details in New Window [Oct 26, 2026]

Tgv High-End Precision Laser Drilling Machine Tgv industrial equipment factory supplier Product Description New Fully Automated Dual-Station Laser Cutter Sets Benchmark for Brittle Material Processing We are pleased to ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Laser Cutting Systems for FPCB Manufacturing Equipment
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16596.

Advanced Precision Laser Cutting Systems for FPCB Manufacturing Equipment Open Details in New Window [Oct 26, 2026]

High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Wafer Grinding Systems for Superior Production Output and Manufacturing Efficiency
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16597.

Precision Wafer Grinding Systems for Superior Production Output and Manufacturing Efficiency Open Details in New Window [Oct 29, 2026]

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Cutting Machine with Real-Time Feedback System for Industrial Applications
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16598.

Precision Laser Cutting Machine with Real-Time Feedback System for Industrial Applications Open Details in New Window [Oct 23, 2026]

Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

CO2 Laser Engraving Machine for Professional Precision Cutting and Etching
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16599.

CO2 Laser Engraving Machine for Professional Precision Cutting and Etching Open Details in New Window [Oct 19, 2026]

Hot Sale CO2 Laser Engraver Universal Laser Cutting Machine Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Premium Silicone Adhesive for Electronics Assembly, Repair, and Maintenance
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16600.

Premium Silicone Adhesive for Electronics Assembly, Repair, and Maintenance Open Details in New Window [Oct 19, 2026]

High quality Automatic Silicone Glue Dispensing Equipment for Semiconductor Industry Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Industrial CO2 Laser Marking Machine with High Precision Performance
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16601.

Industrial CO2 Laser Marking Machine with High Precision Performance Open Details in New Window [Oct 19, 2026]

Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

CCD Vision Fiber Laser Cutting Machine for High Precision Cutting
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16602.

CCD Vision Fiber Laser Cutting Machine for High Precision Cutting Open Details in New Window [Oct 19, 2026]

Product Description MPS-0806D is a small-format fiber laser cutting machine with international standards specially tailored to the needs of the medium and small power laser cutting market. MPS-0806D series products are ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer ID Marking Machine for Semiconductor Wafer Identification and Traceability
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16603.

Wafer ID Marking Machine for Semiconductor Wafer Identification and Traceability Open Details in New Window [Oct 21, 2026]

Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Composite Ground & Vertical Rail Gantry Manipulator
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16604.

Composite Ground & Vertical Rail Gantry Manipulator Open Details in New Window [Oct 26, 2026]

Composite Ground & Vertical Rail Gantry Manipulator Product Description Equipment Structure: This 3-axis gantry adopts a ground rail + vertical rail combined structure. The bottom is a ground rail, fitted with ...

Company: Suzhou Deao Automation Technology Co., Ltd.

Ground Rail Vertical Rail 3-Axis Gantry Manipulator
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16605.

Ground Rail Vertical Rail 3-Axis Gantry Manipulator Open Details in New Window [Oct 26, 2026]

Ground Rail Vertical Rail 3-Axis Gantry Manipulator Product Description Equipment Structure: This 3-axis gantry adopts a ground rail + vertical rail combined structure. The bottom is a ground rail, fitted with ...

Company: Suzhou Deao Automation Technology Co., Ltd.