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Laser Cutting Machine Wood Laser Cutting Machine for Gold Silver Steel
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20941.

Laser Cutting Machine Wood Laser Cutting Machine for Gold Silver Steel Open Details in New Window [Mar 18, 2025]

Princebend Laser Fiber Laser Cutting Machine Performances and Features Small focusing spot, cut fine lines; The fiber machine power consumption is only 20-30% of similar CO2 laser cutting machine. Can use air ...

Company: Nanjing Prince CNC Machinery Co., Ltd

Hot Sale Metal Laser Cutting Machine laser Cut Industrial Machinery Equipment
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20942.

Hot Sale Metal Laser Cutting Machine laser Cut Industrial Machinery Equipment Open Details in New Window [Mar 18, 2025]

Princebend Laser Fiber Laser Cutting Machine Performances and Features Small focusing spot, cut fine lines; The fiber machine power consumption is only 20-30% of similar CO2 laser cutting machine. Can use air ...

Company: Nanjing Prince CNC Machinery Co., Ltd

Hot Sale CO2 Laser Engraver Universal Laser Cutting Machine
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20943.

Hot Sale CO2 Laser Engraver Universal Laser Cutting Machine Open Details in New Window [Mar 13, 2025]

Hot Sale CO2 Laser Engraver Universal Laser Cutting Machine Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Hot Sale High Accuracy FPC Window Laser Engraving and Cutting Machine
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20944.

Hot Sale High Accuracy FPC Window Laser Engraving and Cutting Machine Open Details in New Window [Mar 12, 2025]

Hot Sale High Accuracy FPC Window Laser Engraving and Cutting Machine Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing
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20945.

High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Open Details in New Window [Mar 12, 2025]

High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

IC Chips Green Laser Marking Machine with Imported Double-Head 20W Fiber Laser Marking System
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20946.

IC Chips Green Laser Marking Machine with Imported Double-Head 20W Fiber Laser Marking System Open Details in New Window [Mar 12, 2025]

IC Chips Green Laser Marking Machine with Imported Double-Head 20W Fiber Laser Marking System Product Description Brief Description Applicable for the packaged IC marking of DIP, QFN and BGA. Features: 1. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Plate Tube Optical Fiber Laser Cutting Equipment for Laser Cutting of Metal Pipes/Plates
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20947.

Plate Tube Optical Fiber Laser Cutting Equipment for Laser Cutting of Metal Pipes/Plates Open Details in New Window [Feb 28, 2025]

Product Description MPS-DT is one of the flagship products, mainly used for cutting thin metal plates and laser cutting of metal pipes such as round, square, rectangular, and elliptical pipes made of ordinary carbon ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Cutting Machine for FPC Picosend UV Laser with CCD Visual Automatic System
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20948.

Cutting Machine for FPC Picosend UV Laser with CCD Visual Automatic System Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Green Laser Dual Platform FPC Cutting and Engraving
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20949.

Green Laser Dual Platform FPC Cutting and Engraving Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Carbon Dioxide Laser Marking Machine Used for Craft Gifts, Fixtures, Leather Clothing, Advertising ...
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20950.

Carbon Dioxide Laser Marking Machine Used for Craft Gifts, Fixtures, Leather Clothing, Advertising ... Open Details in New Window [Feb 28, 2025]

Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, model ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Cutting and Engraving Machine for Windows
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20951.

High-Precision Laser Cutting and Engraving Machine for Windows Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Cutting Machine for FPC Laser with CCD Visual Automatic System
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20952.

Cutting Machine for FPC Laser with CCD Visual Automatic System Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dual Platform Laser FPC Cutting and Engraving
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20953.

Dual Platform Laser FPC Cutting and Engraving Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fiber Laser Marking Machine China Products/Suppliers 20W 30W 50W Fiber Laser Marking Machine Metal ...
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20954.

Fiber Laser Marking Machine China Products/Suppliers 20W 30W 50W Fiber Laser Marking Machine Metal ... Open Details in New Window [Feb 28, 2025]

Product Description Applications: Widely used in mobile power, mobile phone shells, aluminum oxide blackening, tablet computers, rings, hand bones, watches, water cups, glasses, clocks, keys, instruments, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Picosecond Green Dual Platform Laser Cutting Machine for FPC Cutting and Engraving
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20955.

Picosecond Green Dual Platform Laser Cutting Machine for FPC Cutting and Engraving Open Details in New Window [Feb 28, 2025]

Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.