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Kcl-3015 China Laser Cutting Machine 1000W
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12871.

Kcl-3015 China Laser Cutting Machine 1000W Open Details in New Window [Oct 08, 2024]

Products Description Performance. Professional mechanical design, novel appearance modeling and a number of patented technologies, with high degree of refinement, fast speed, small cutting seam, smooth section, ...

Company: Nanjing Jinqiu CNC Machine Tool Co., Ltd.

Advanced Precision Laser Marking Machine for Safe Operations
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12872.

Advanced Precision Laser Marking Machine for Safe Operations Open Details in New Window [Jul 08, 2026]

Product Description Wafer Marking 1. Product compatible size: 8-12 inch ring crystal cage; 2. Equipped with a crystal loading system that supports Cassette loading; 3. Robot robotic arm transmission; 4. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Cutting Machine for Jewelry and Eyewear Production
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12873.

Advanced Laser Cutting Machine for Jewelry and Eyewear Production Open Details in New Window [Jul 08, 2026]

Product Description MPS-0806D is a small-format fiber laser cutting machine with international standards specially tailored to the needs of the medium and small power laser cutting market. MPS-0806D series products are ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Fiber Laser Cutter for Precision Manufacturing Solutions
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12874.

High-Performance Fiber Laser Cutter for Precision Manufacturing Solutions Open Details in New Window [Jul 08, 2026]

High-Quality Fiber Laser Cutting Equipment with High Reliability and User-Friendly Operation Product Description MPS-0806D is a small-format fiber laser cutting machine with international standards specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Cutting Equipment for Semiconductor Wafer Production
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12875.

Precision Laser Cutting Equipment for Semiconductor Wafer Production Open Details in New Window [Jul 08, 2026]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision 5W Portable Bottle and Pipe Marking Tool
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12876.

High-Precision 5W Portable Bottle and Pipe Marking Tool Open Details in New Window [Jul 08, 2026]

Product Description Brief Description UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Marking Solution for Automotive PCBA Parts
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12877.

High-Precision Laser Marking Solution for Automotive PCBA Parts Open Details in New Window [Jul 08, 2026]

Fast Speed / High Response Large Format PCBA Laser Marking Machine for Automotive Circuits Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dk7725 EDM Wire Cutting Tools for High-Performance Results
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12878.

Dk7725 EDM Wire Cutting Tools for High-Performance Results Open Details in New Window [Jul 06, 2026]

Product Description PERFORMANCE An EDM Wire Cutting Machine, also known as Wire Electrical Discharge Machining, is a precision machining technology that utilizes controlled electrical sparks to cut complex shapes and ...

Company: Supertech Machine Tool Co., Ltd.

CNC H Beam Laser Cutting Drilling Machine for Structural Steel Processing Line
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12879.

CNC H Beam Laser Cutting Drilling Machine for Structural Steel Processing Line Open Details in New Window [Jul 02, 2026]

Product Parameters Model ZX-FCX50120 Profile Steel Cutting Range Height:150mm~800mm Width:250mm~1200mm Length<= 26000mm X-Axis Travel 2000mm Y-Axis Travel 26000mm Z-Axis Travel 900mm X/Y Axis ...

Company: Wuxi Zhouxiang Complete Set of Welding Equipment Co., Ltd.

Precision Laser Engraving System for High-Quality PCB Production
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12880.

Precision Laser Engraving System for High-Quality PCB Production Open Details in New Window [Jul 01, 2026]

High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Quality Fiber Laser Marking System for Global Markets
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12881.

High-Quality Fiber Laser Marking System for Global Markets Open Details in New Window [Jun 29, 2026]

Product Description Model G20 20W Fiber Laser Marking System Precision, Speed, and Reliability for Demanding Industrial Marking The Model G20 is a high-performance, 20W fiber laser marking system engineered for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Wafer Grinding Machine for High-Volume Industry Use
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12882.

Precision Wafer Grinding Machine for High-Volume Industry Use Open Details in New Window [Jun 29, 2026]

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Innovative Laser Cutting Solutions for Efficient FPCB Manufacturing
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12883.

Innovative Laser Cutting Solutions for Efficient FPCB Manufacturing Open Details in New Window [Jun 29, 2026]

High Quality Automatic FPCB Laser Cutting and Placing Machine Product Description Double-click for dual-station synchronous high-speed and precise cutting of optical materials. Fully automatic cutting, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Mopa Fiber Laser Marking System for Precision Semiconductor Chips
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12884.

Advanced Mopa Fiber Laser Marking System for Precision Semiconductor Chips Open Details in New Window [Jun 29, 2026]

Product Description HMLA-G Series Fiber Laser Marking Machine - Specification Sheet Category Specification Details Model Series Name HMLA-G Series Laser Source Type MOPA Fiber ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Custom 3000W Laser Cutting Machine for Aluminum and Copper Projects
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12885.

Custom 3000W Laser Cutting Machine for Aluminum and Copper Projects Open Details in New Window [Jun 27, 2026]

SHEET FIBER LASER CUTTING MACHINE Specification Key Functional Components 1. Machine Tool Main Bed 1) Crafted from premium steel, featuring strategic welding for enhanced rigidity and stability. 2) Stress-relief ...

Company: Jiangsu SOHO Innovation & Technology Group Kasin Industry & Trade Co., Ltd.