Jiangsu Profile
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Product List
14476. Precision Water-Guided Laser Diamond Cutting Machine for Special Shapes 
[Mar 03, 2026]
[Mar 03, 2026] Product Description THREE-AXIS PRECISION WATER-GUIDED LASER CUTTING MACHINE A three-axis precision water-guided laser cutting machine that combines high-accuracy laser processing with water-jet guidance to deliver ...
Company: Changzhou CONOVO CNC Tech. Co., Ltd.
14477. Precision Water-Guided Diamond Cutting Machine for Unique Designs [Mar 03, 2026]
[Mar 03, 2026] Product Description THREE-AXIS PRECISION WATER-GUIDED LASER CUTTING MACHINE A three-axis precision water-guided laser cutting machine that combines high-accuracy laser processing with water-jet guidance to deliver ...
Company: Changzhou CONOVO CNC Tech. Co., Ltd.
14478. Precision UV Laser Cutter for Flexible Pcbs and Fpcs [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
14479. Advanced Fully Automatic Wafer Marking Machine for 2D and 1d Codes [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Marking Equipment Suitable for Marking 2D Codes/One-Dimensional Codes Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional ...
14480. High-Power 10W/15W/25W UV Laser Engraving Machine for Wood and Metal [Feb 28, 2026]
[Feb 28, 2026] 4W / 7W / 10W /15W / 25W 355nm UV Laser Engraving Machine Wood and Metal Laser Engraver Machine Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. ...
14481. Advanced High-Precision FPC Laser Cutter with CCD Technology [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser Type Picosecond Green Laser Processing Area 250mmx500mm(Customized) Machine size 1700×1650×1850mm Machinhe Cutting Accuracy ±0.02mm Electric Power ...
14482. High-Precision UV Laser Cutting Machine for Wafer Production [Feb 28, 2026]
[Feb 28, 2026] High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
14483. High-Precision Fully Automatic Dicing Machine for 300mm Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description ML3200 Equipped with an IR laser engine, with the laser beam focused on the silicon interior, this machine forms laser processing regions and performs singulation into chips in the expansion ...
14484. Advanced Metal Fiber Laser Marking Machine for Precision Engraving [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
14485. Precision Fiber Laser Engraving Machine for Curved Surfaces [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch ...
14486. High-Precision UV Laser Marking Machine for Mobile Phone PCB [Feb 28, 2026]
[Feb 28, 2026] Product Description Brief Description Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on. Marking on the Rigid and flexible printed circuit board ...
14487. Advanced Silicone Dispenser for Accurate and Efficient Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity + Pneumatic Function Automatical Production Detailed Photos Dispensing ...
14488. Startnow Hans Original Protective Lens 21.5*2 15kw Laser Protection Accessories Ceramic Ring Parts ... [Feb 11, 2026]
[Feb 11, 2026] Han's original protective lens ceramic ring Protective Lens:21.5*2 15KW,24.4*2 20KW,30*5 3KW,34*5 8KW,37*7 15KW,04.17.0279,42*4 15KW,55*9 20KW(04.17.0000056),55*9 20KW(04.17.0000164) Ceramic:D31 ...
14489. Diamond Beam Material 6005-T6, 34kg/M [Jan 29, 2026]
[Jan 29, 2026] Product Description Specification Company Profile
14490. Max Mfp-100W Pulse Laser Machine for Engraving Machines [Jan 16, 2026]
[Jan 16, 2026] MFP 100W~200W Fiber Laser Specifications Models MFP-100W MFP-200W OPTICAL SPECIFICATIONS Nominal Power 100W 200W Mode of Operation Pulsed Polarization Random Power Tunability 5 to 100% Wavelength 1064 ± 5 nm Power ...
