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12000W 13025 Extended Table Fiber Laser Cutting Machine for Container Panels
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1726.

12000W 13025 Extended Table Fiber Laser Cutting Machine for Container Panels Open Details in New Window [Sep 08, 2026]

Product Overview 12000W 13m Ultra Long Metal Sheet Laser Cutting Machine YL-D-13025 12000W 13m Ultra Long Metal Sheet Laser Cutting Machine YL-D-13025 is configured with a 13000 x 2500 mm processing range and 12000W ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

Picosecond Flawless-Edge Laser Cutting & Splitting Machine for Brittle Ceramic
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1727.

Picosecond Flawless-Edge Laser Cutting & Splitting Machine for Brittle Ceramic Open Details in New Window [Sep 29, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Automatic Feeding Laser Pipe Cutting Machine for Long Length Metal Pipes
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1728.

Automatic Feeding Laser Pipe Cutting Machine for Long Length Metal Pipes Open Details in New Window [Sep 29, 2026]

High-power fiber laser pipe cutting machine Our automatic feeding laser pipe cutting machine is designed for continuous processing of long metal pipes and tubes. The feeding system reduces manual handling and supports ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

Thick Plate Laser Cutting Machine for Laser Cutting of Plates
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1729.

Thick Plate Laser Cutting Machine for Laser Cutting of Plates Open Details in New Window [Sep 29, 2026]

Category Item Specification Processing Area & Working Range Processing Area (L × W) 13000 mm × 3000 mm X-Axis Travel 3030 mm Y-Axis Travel 13030 mm Z-Axis Travel 150 mm Accuracy X, Y ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

12kw Fiber Laser Cutting Machine for Dust Removal Environmental Protection Metal Cutting
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1730.

12kw Fiber Laser Cutting Machine for Dust Removal Environmental Protection Metal Cutting Open Details in New Window [Sep 29, 2026]

Category Item Specification Processing Area & Working Range Processing Area (L × W) 13000 mm × 3000 mm X-Axis Travel 3030 mm Y-Axis Travel 13030 mm Z-Axis Travel 150 mm Accuracy X, Y Axis Positioning Accuracy ±0.05 mm/m ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

Ground Rail Heavy Duty CNC Laser Cutting Machine for Thick Plate Cutting
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1731.

Ground Rail Heavy Duty CNC Laser Cutting Machine for Thick Plate Cutting Open Details in New Window [Sep 29, 2026]

Category Item Specification Processing Area & Working Range Processing Area (L × W) 12000 mm × 2500 mm X-Axis Travel 2530 mm Y-Axis Travel 12050 mm Z-Axis Travel 150 mm Accuracy X, Y ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

3015 3000W Exchange Table Fiber Laser Cutting Machine for Carbon & Stainless Steel
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1732.

3015 3000W Exchange Table Fiber Laser Cutting Machine for Carbon & Stainless Steel Open Details in New Window [Sep 29, 2026]

Product Overview 3000W Exchange Table Fiber Laser Cutting Machine YL-S-3015 3000W Exchange Table Fiber Laser Cutting Machine YL-S-3015 is configured with a 3050 x 1530 mm processing range and 3000W laser power. ...

Company: Jiangsu Yiyan Machinery Technology Co., Ltd.

Picosecond Micro-Crack-Free Laser Cutting & Splitting Machine for Ceramic
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1733.

Picosecond Micro-Crack-Free Laser Cutting & Splitting Machine for Ceramic Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Picosecond Smooth-Finish Laser Cutting & Splitting Machine for Ceramic
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1734.

Picosecond Smooth-Finish Laser Cutting & Splitting Machine for Ceramic Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Advanced UV Laser Engraving Machine for Die Marking Solutions
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1735.

Advanced UV Laser Engraving Machine for Die Marking Solutions Open Details in New Window [Sep 28, 2026]

Product Description Fully Automatic Wafer DIE Laser Marking System: The Future of Semiconductor Marking Introduction The Fully Automatic Wafer DIE Laser Marking System is a cutting-edge semiconductor marking ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Picosecond High-Finesse Laser Cutting & Splitting Machine for Ceramic Substrate
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1736.

Picosecond High-Finesse Laser Cutting & Splitting Machine for Ceramic Substrate Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Picosecond Clean-Cut Laser Cutting & Splitting Machine for Hard Ceramics
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1737.

Picosecond Clean-Cut Laser Cutting & Splitting Machine for Hard Ceramics Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Picosecond Stable Laser Cutting & Splitting Machine for Consistent Ceramic Machining
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1738.

Picosecond Stable Laser Cutting & Splitting Machine for Consistent Ceramic Machining Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Picosecond Cold Processing Laser Cutting & Splitting Machine for Smooth Ceramic
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1739.

Picosecond Cold Processing Laser Cutting & Splitting Machine for Smooth Ceramic Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Picosecond Cold Process Laser Cutting & Splitting Machine for Delicate Ceramic Components
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1740.

Picosecond Cold Process Laser Cutting & Splitting Machine for Delicate Ceramic Components Open Details in New Window [Sep 28, 2026]

Technical Specifications With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability. It excels in micro-cutting, drilling, and patterning tasks, meeting the ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.