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Affordable High-Precision Pulse Laser Marking Machine for All Materials
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5071.

Affordable High-Precision Pulse Laser Marking Machine for All Materials Open Details in New Window [Dec 13, 2025]

Product Description Using a pulsed fiber laser, paired with a self-developed intelligent control system, the laser pulse frequency and pulse width are independently adjustable. Red light assistance is available for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
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5072.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing Open Details in New Window [Dec 13, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision UV Laser Marking Machine for Electronics
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5073.

High Precision UV Laser Marking Machine for Electronics Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

OLED Pi Film Cvl Picosecond UV Laser Cutting Machine
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5074.

OLED Pi Film Cvl Picosecond UV Laser Cutting Machine Open Details in New Window [Dec 13, 2025]

Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor
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5075.

High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor Open Details in New Window [Dec 13, 2025]

Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Hot Sales Fiber CO2 Laser Marking Machine with Split Type Compact Design
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5076.

Hot Sales Fiber CO2 Laser Marking Machine with Split Type Compact Design Open Details in New Window [Dec 13, 2025]

Product Description Himalaya Semiconductor Split-type CO2 Laser Marking Machine | Precision & Versatility Experience the perfect blend of precision, power, and flexibility with the Himalaya Semiconductor Split-type CO2 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors
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5077.

Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors Open Details in New Window [Dec 13, 2025]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality Laser Making/Markig Machine for FPC/PCB Board with Innovative Processing Technology
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5078.

High Quality Laser Making/Markig Machine for FPC/PCB Board with Innovative Processing Technology Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

60/80W Mopa Fiber Laser Engraving Machine for Precision Metal Cutting and Marking
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5079.

60/80W Mopa Fiber Laser Engraving Machine for Precision Metal Cutting and Marking Open Details in New Window [Dec 13, 2025]

Product Description Introducing our state-of-the-art Portable MOPA Fiber Laser Marking Machine, meticulously crafted for flawless precision in marking both metallic and selected non-metallic surfaces. This ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer
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5080.

80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer Open Details in New Window [Dec 13, 2025]

Product Description High-Precision Laser Scribing Machine for Superior Wafer Yield Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Interactive Laser Cutting Machine with Real-Time Feedback
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5081.

Advanced Interactive Laser Cutting Machine with Real-Time Feedback Open Details in New Window [Dec 13, 2025]

Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive fiber laser cutting equipment. It has the advantages of stable performance, high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High-Precision Laser Trimming Machine for LED Displays
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5082.

Advanced High-Precision Laser Trimming Machine for LED Displays Open Details in New Window [Dec 13, 2025]

Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Flexible Screen UV Picosecond Laser Cutting Machine for OLED or LCD
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5083.

Flexible Screen UV Picosecond Laser Cutting Machine for OLED or LCD Open Details in New Window [Dec 13, 2025]

Product Description Flexible Screen UV Laser Cutting Machine A Flexible Screen UV Laser Cutting Machine is a specialized piece of equipment designed for cutting flexible displays. It utilizes ultraviolet (UV) laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Affordable High-Precision Fiber Laser Marking Machine for Global Buyers
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5084.

Affordable High-Precision Fiber Laser Marking Machine for Global Buyers Open Details in New Window [Dec 13, 2025]

Product Description Model G20 20W Fiber Laser Marking System Precision, Speed, and Reliability for Demanding Industrial Marking The Model G20 is a high-performance, 20W fiber laser marking system engineered for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

20W Fiber Laser Engraving Machine for Metal and Non-Metal
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5085.

20W Fiber Laser Engraving Machine for Metal and Non-Metal Open Details in New Window [Dec 13, 2025]

20W Fiber Laser Marking Machine for Stainless Steel/Carbon Steel/Aluminum/Copper Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.