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Newest Aeon Laser Redline Mira5s Engraving Cutting Machine Mira5 S 40W 60W RF 30W 60W Watt Laser ...
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7201.

Newest Aeon Laser Redline Mira5s Engraving Cutting Machine Mira5 S 40W 60W RF 30W 60W Watt Laser ... Open Details in New Window [Dec 03, 2025]

Product Description Specification Parameters Model MIRA5 S MIRA7 S MIRA9 S Working Scope Working Area (mm) 500*300mm 700*500mm 900x600mm Z Axis Lifting Space 140mm Max Lifting Capacity 15KG 25KG 25KG Laser Tube Laser ...

Company: Suzhou Aeon Laser Technology Co., Ltd.

Fyxfer 3 in 1 Multifunction Metal Rust Remover Handheld Fiber Laser Cleaning Welding Cutting Machine
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7202.

Fyxfer 3 in 1 Multifunction Metal Rust Remover Handheld Fiber Laser Cleaning Welding Cutting Machine Open Details in New Window [Dec 07, 2025]

MACHINE DETAILS Power 1500/2000/3000W Functions 4 in 1 (cutting, cleaning, seam cleaning & welding) Laser Wavelength 1080±1nm Operating Mode Continuous or modulated Max Modulation Frequency 100KHZ Scan Width 0-6mm ...

Company: Yangzhou Fengyue CNC Technology Co., Ltd.

Handheld Laser Welding Cutting Cleaning 3 in 1 Machine for Metal Carbon Stainless Steel Aluminum ...
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7203.

Handheld Laser Welding Cutting Cleaning 3 in 1 Machine for Metal Carbon Stainless Steel Aluminum ... Open Details in New Window [Dec 07, 2025]

MACHINE DETAILS Power 1500/2000/3000W Functions 4 in 1 (cutting, cleaning, seam cleaning & welding) Laser Wavelength 1080±1nm Operating Mode Continuous or modulated Max Modulation Frequency 100KHZ Scan Width 0-6mm ...

Company: Yangzhou Fengyue CNC Technology Co., Ltd.

Aeon Mira 9s Wood Cutter CO2 Laser Engraving Cutting Machine with Ruida System Autofocus
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7204.

Aeon Mira 9s Wood Cutter CO2 Laser Engraving Cutting Machine with Ruida System Autofocus Open Details in New Window [Nov 28, 2025]

Product Description Specification Parameters Model MIRA5 S MIRA7 S MIRA9 S Working Scope Working Area (mm) 500*300mm 700*500mm 900x600mm Z Axis Lifting Space 140mm Max Lifting Capacity 15KG 25KG 25KG Laser Tube Laser ...

Company: Suzhou Aeon Laser Technology Co., Ltd.

Max Handheld Laser Cleaning Machine 380V/220Hz 2kw/3K/6kw
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7205.

Max Handheld Laser Cleaning Machine 380V/220Hz 2kw/3K/6kw Open Details in New Window [Dec 16, 2025]

Product Description Overview: Laser Cleaning Machine Series This series consists of single-function laser cleaning equipment specifically designed for metal surface treatment—removing rust, paint, oxide layers, oil, and ...

Company: TANG CHENG INTERNATIONAL TRADE CO., LTD.

High Precision Laser Measurement EDM Machine for Accurate Cutting
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7206.

High Precision Laser Measurement EDM Machine for Accurate Cutting Open Details in New Window [Dec 17, 2025]

HANQI HQ63GZ-AS CNC Wire Cutting EDM Machine Full cooperated with AgieCharmilles, original GF technology support By Hanqi Wire Cut EDM Machine you are able to process all the conductive objects, such as complex shape ...

Company: Suzhou HanQi CNC Equipment Co., Ltd.

Tube and Pipe Laser Cutting Machine
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7207.

Tube and Pipe Laser Cutting Machine Open Details in New Window [Dec 18, 2025]

Princebend Laser Fiber Laser Cutting Machine Performances and Features Small focusing spot, cut fine lines; The fiber machine power consumption is only 20-30% of similar CO2 laser cutting machine. Can use air ...

Company: Nanjing Prima CNC Machinery Co., Ltd.

Advanced Wafer Laser Scribing and Cutting Machine with Versatile Modes
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7208.

Advanced Wafer Laser Scribing and Cutting Machine with Versatile Modes Open Details in New Window [Dec 13, 2025]

Product Description Product Features Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency Correction technology ensures high precision machining and consistency ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Cutting Machine for PCBA Applications
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7209.

High-Precision UV Laser Cutting Machine for PCBA Applications Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Efficient High Stability UV Laser Marking Cutting Machine for Wafers Cutting Processing
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7210.

High-Efficient High Stability UV Laser Marking Cutting Machine for Wafers Cutting Processing Open Details in New Window [Dec 13, 2025]

High Precision High-Efficient UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Sealing and Decapping Machine for Superior Production Efficiency
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7211.

Laser Sealing and Decapping Machine for Superior Production Efficiency Open Details in New Window [Dec 13, 2025]

Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser decaping ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

HD650L2 Series Double Axis Double Table CO2 Laser Drilling Machine
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7212.

HD650L2 Series Double Axis Double Table CO2 Laser Drilling Machine Open Details in New Window [Dec 13, 2025]

Product DescriptionHD650L2 SERIES Product advantages The new laser and high speed scanning galvanometer are specially customized for the processingof smaller and micro blind holes and through holes. Maintenance-free ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fiber Laser Cutting Machine with Intuitive Controls
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7213.

Advanced Fiber Laser Cutting Machine with Intuitive Controls Open Details in New Window [Dec 13, 2025]

Product Description Mps-0806h is a product specially for the sheet metal industry. It is mainly used for sheet metal cutting, closed structure, excellent performance, stability and high cost performance. Model ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision UV Laser Annealing Machine for Bsi-CCD Wafers
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7214.

High-Precision UV Laser Annealing Machine for Bsi-CCD Wafers Open Details in New Window [Dec 13, 2025]

Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Drilling Machine for Thin Film Materials
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7215.

High-Precision Laser Drilling Machine for Thin Film Materials Open Details in New Window [Dec 13, 2025]

Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.