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Energy Saving Servo Driven Plastic Injection Molding Machine
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7876.

Energy Saving Servo Driven Plastic Injection Molding Machine Open Details in New Window [Mar 28, 2025]

Plastic Injection Molding Machine The Plastic Injection Molding Machine is a state-of-the-art specialized equipment that plays a pivotal role in crafting a vast array of plastic products. By expertly heating and ...

Company: Zhangjiagang Deling Machinery Co, Ltd

Hydraulic Pipe Bender Machine for Metal Tube with 5.5kw Power
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7877.

Hydraulic Pipe Bender Machine for Metal Tube with 5.5kw Power Open Details in New Window [Mar 23, 2025]

In today's cutting-edge metal processing industry, the refinement and prowess of precision pipe forming technology are pivotal. These innovations not only enhance product performance but also drive down ...

Company: Zhangjiagang Deling Machinery Co, Ltd

Large Caliber Plastic HDPE PE PP Pipe Extrusion Production Line /Making Machine
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7878.

Large Caliber Plastic HDPE PE PP Pipe Extrusion Production Line /Making Machine Open Details in New Window [Feb 27, 2025]

Large Caliber Plastic HDPE PE PP Pipe Extrusion Production Line /Making Machine Product Description The production line uses our special high performance extruder for HDPE (PP, ABS) pipes, the screw adopts a ...

Company: Zhangjiagang Chenxing Machinery Co., Ltd.

Cleaning Street Sweeper Road Cleaning Dust Suction Truck Road Sweeper Machine
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7879.

Cleaning Street Sweeper Road Cleaning Dust Suction Truck Road Sweeper Machine Open Details in New Window [Feb 25, 2025]

Specification It is used for cleaning the bleeding cement, mud, quick soil out from the road surface. It also can blow away the impurities and dust of road surface. It has advantages of improving working ...

Company: Heavsty Transportation Technology (Jiangsu) Co., Ltd.

PP PE HDPE Plastic Pipe Production Line / Making Machine
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7880.

PP PE HDPE Plastic Pipe Production Line / Making Machine Open Details in New Window [Feb 22, 2025]

PP PE HDPE Plastic Pipe Production Line / Making Machine Product Description The production line uses our special high performance extruder for HDPE (PP, ABS) pipes, the screw adopts a structure with barrier and ...

Company: Zhangjiagang Chenxing Machinery Co., Ltd.

Semi Automatic Shrink Label Sticker Labeling Machine/Semi Auto Round Bottle Labeling Machine
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7881.

Semi Automatic Shrink Label Sticker Labeling Machine/Semi Auto Round Bottle Labeling Machine Open Details in New Window [Nov 26, 2023]

Semi automatic shrink label sticker labeling machine/semi auto round bottle labeling machine Stick labeling machine: Basic use: The fully automatic positioning vertical round bottle labeling machine is specially ...

Company: ZhangJiaGang Honor Machine Co., Ltd.

Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board
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7882.

Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, PCB Board Open Details in New Window [Oct 24, 2025]

Product Description Our Automatic Dicing Saw Machine can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc. X axis maximum effective input rang of feed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China High Speed Automatic Glue Dispenser Machine for LED Lens
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7883.

China High Speed Automatic Glue Dispenser Machine for LED Lens Open Details in New Window [Oct 24, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine
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7884.

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Open Details in New Window [Oct 22, 2025]

High Efficiency Fully Automatic Lead Wire Bonding Bonder Machine Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
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7885.

Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing Open Details in New Window [Oct 22, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
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7886.

12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly Open Details in New Window [Oct 22, 2025]

12inch Fully automatic soft solder die bonding machine factory Product Description This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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7887.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Oct 20, 2025]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Double Ends Terminal Crimping Machine with Cable Marker Tube/ Sleeve Inserting
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7888.

Automatic Double Ends Terminal Crimping Machine with Cable Marker Tube/ Sleeve Inserting Open Details in New Window [Oct 16, 2025]

Product Description BZW-3.0+H+M Automatic high precise double ends terminal crimping machine with cable marker tube/ sleeve inserting This equipment is upgrade ...

Company: Jiangsu Bozhiwang Automation Equipment Co., Ltd.

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt
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7889.

Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt Open Details in New Window [Oct 16, 2025]

Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform
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7890.

High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Open Details in New Window [Oct 16, 2025]

High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.