Jiangsu Profile
Product List
8221. New Factory PVC Paper Card Cutter Machine for Manufacturing Plants with Siemens PLC Motor Core ... 
[Jun 04, 2024]
[Jun 04, 2024] Product Description Microcomputer Roll to sheet Cutting Machine with Elevating Material Rack Features: 1. The max width: 500mm 2. Tolerence: 0.05mm, Precision: 0.1mm 3. Material thickness: 0.5mm-15mm 4. ...
8222. China Famous Automaticsteel Beer Keg/Can/Barrel/Drum Production Line Machines [Feb 12, 2026]
[Feb 12, 2026] Fully Automatic Stainless Steel Beer Keg/Can/Barrel/Drum Production Line Machines^ Beer Keg Production Making Machine Stainless steel kegs produced by our machines Technical Specification of ...
8223. Advanced Electroplating Cleaning Machine for Precision Metal Finishing [Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
8224. Automatic Glue Dispenser Machine Three-Axis Desktop Dispensing Robot Vision Glue Dispensing Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding point- CE certifed Optional Features Automatic constant ...
8225. High Precision UV Laser Cutting Machine for Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
8226. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
8227. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
8228. 355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB [Feb 28, 2026]
[Feb 28, 2026] Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...
8229. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
8230. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
8231. High-Precision CCD Glue Dispensing Machine for Exact Placement [Feb 28, 2026]
[Feb 28, 2026] Product Description This is a modular, vision-guided, high-speed precision dispensing system designed for advanced electronics manufacturing. Its standout features are chip-body recognition for exceptional accuracy, ...
8232. Innovative Plasma Treatment Machine for Effective Surface Cleaning [Feb 28, 2026]
[Feb 28, 2026] Plasma Treatment System Cleaning Machine Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - ...
8233. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
8234. Fully Automatic Butyl Adhesive Coating Machine [Feb 28, 2026]
[Feb 28, 2026] Features •The glue process only melts the top part of the barrel glue and the remaining material remains solid, reducing the influence of thermal stress on the original characteristics ot the glue; •The ...
8235. Projection Lithography Machine Suitable for Packaging Micro LED Mems [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
