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Vmc1160 Vertical Machine Center with Safety Protection and Fault Diagnosis Alarm Function
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8536.

Vmc1160 Vertical Machine Center with Safety Protection and Fault Diagnosis Alarm Function Open Details in New Window [Sep 18, 2025]

Product Introduction and Use This product X, Y, Z three-axis servo direct control semi-closed vertical machining center, three-axis linear ball guide, guide rail load, span wide, high precision, suitable for heavy ...

Company: NANJING ALPHA CNC CO., LTD

Factory Outlet Precision Cutting Machine with Excellent Processing System/Friendly Interface
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8537.

Factory Outlet Precision Cutting Machine with Excellent Processing System/Friendly Interface Open Details in New Window [Sep 18, 2025]

Product Description Mps-0303l precision laser cutting machine is a linear motor platform, with high precision, high speed, good cutting quality, processing width of 300 mm × 300 mm, which can be used in ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Custom SMT Coating Machine for PCB LED SMT Coating Machine for PCB Automatic UV Coating Spray Line
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8538.

Custom SMT Coating Machine for PCB LED SMT Coating Machine for PCB Automatic UV Coating Spray Line Open Details in New Window [Sep 18, 2025]

Product Description Standard Features 1. 2 valves can be accommodated in the standard machine 2. PC with LCD monitors, keyboard and mouse 3. Auto dipping and purging waste collection system 4. LED UV lamps ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Real-Time Detection Laser Drilling Machine for Circuit Board
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8539.

High-Precision Real-Time Detection Laser Drilling Machine for Circuit Board Open Details in New Window [Sep 18, 2025]

Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Ssx-Pecvd Tube Type Automatic Loading and Unloading Wafer Machine
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8540.

Ssx-Pecvd Tube Type Automatic Loading and Unloading Wafer Machine Open Details in New Window [Sep 18, 2025]

Product Description G Texturing And Etching Automatic Loading And Unloading Machine Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process Main Technical Parameter Capacity(2 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fiber Laser Cutting Machine for Various Alloy Materials Pipe
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8541.

Fiber Laser Cutting Machine for Various Alloy Materials Pipe Open Details in New Window [Sep 18, 2025]

Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Substrate Bonder Machine with Automatic Optical Focusing Integration Technology
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8542.

Wafer Substrate Bonder Machine with Automatic Optical Focusing Integration Technology Open Details in New Window [Sep 18, 2025]

Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine
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8543.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine Open Details in New Window [Sep 18, 2025]

Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-K/CMOS Wafer Laser Grooving Cutting Machine
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8544.

Low-K/CMOS Wafer Laser Grooving Cutting Machine Open Details in New Window [Sep 18, 2025]

Low-K/CMOS Wafer Laser Grooving Cutting Machine Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with special customized laser head, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Guaranteed Quality Semiconductor Debonding Machine with Strong Wear Resistance
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8545.

Guaranteed Quality Semiconductor Debonding Machine with Strong Wear Resistance Open Details in New Window [Sep 18, 2025]

Product Description features Automatic glue remover also known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) of the gate runner of the product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ...
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8546.

Precision Drilling/Cutting/Scribing Machine for Alumina/Aluminiumnitride/Zirconium ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System
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8547.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System Open Details in New Window [Sep 18, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
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8548.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop Open Details in New Window [Sep 18, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ...
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8549.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ... Open Details in New Window [Sep 18, 2025]

Product Description MPS-1010D is a product specially for the metal sheet industry, mainly used for cutting 0.5mm-16mm metal flat plates. It has a closed structure, superior performance, stability, and extremely high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance
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8550.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Open Details in New Window [Sep 18, 2025]

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.