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Custom SMT Coating Machine for PCB LED SMT Coating Machine for PCB Automatic UV Coating Spray Line
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9031.

Custom SMT Coating Machine for PCB LED SMT Coating Machine for PCB Automatic UV Coating Spray Line Open Details in New Window [Mar 19, 2025]

Product Description Standard Features 1. 2 valves can be accommodated in the standard machine 2. PC with LCD monitors, keyboard and mouse 3. Auto dipping and purging waste collection system 4. LED UV lamps ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Trimming Automation Machine with Fully Automatic Loading / Unloading Mechanism
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9032.

High-Precision Laser Trimming Automation Machine with Fully Automatic Loading / Unloading Mechanism Open Details in New Window [Mar 19, 2025]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Factory Price High Precision Automatic Dispensing Machine for SMT for PCB
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9033.

China Factory Price High Precision Automatic Dispensing Machine for SMT for PCB Open Details in New Window [Feb 28, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic High Precision Cost Efficient Dispersion Glue Machine with Vision CCD
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9034.

Automatic High Precision Cost Efficient Dispersion Glue Machine with Vision CCD Open Details in New Window [Feb 28, 2025]

Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball screw 4. Inline CCD visual programming or gerber upload 5. UPS and voltage ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Direct Supplied Silicone Adhesive Gluing Dispenser Machine for Assembly Line
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9035.

Factory Direct Supplied Silicone Adhesive Gluing Dispenser Machine for Assembly Line Open Details in New Window [Feb 28, 2025]

Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine
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9036.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine Open Details in New Window [Feb 28, 2025]

Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine
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9037.

High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine Open Details in New Window [Feb 28, 2025]

Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making
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9038.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System
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9039.

High Precision Wafer Bonder Flipchip Eutectic Bonding Machine with Die Attach System Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Direct Sales Qfn Testing and Sorting Machine (Packaging size 3mmx3mmw~50mmx50mm)
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9040.

Factory Direct Sales Qfn Testing and Sorting Machine (Packaging size 3mmx3mmw~50mmx50mm) Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1&times;4 mode Test mode Room temperature Material handling cart Supports ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing
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9041.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1&times;4 mode Test mode Room temperature Material handling cart Supports ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine
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9042.

High Precision Semiconductor Chip Eutectic Wafer Turret Loading and Unloading Machine Open Details in New Window [Feb 25, 2025]

Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Speed and High Precision Spraying Precise Coating Machine for Complex Parts/Variable Parts
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9043.

High Speed and High Precision Spraying Precise Coating Machine for Complex Parts/Variable Parts Open Details in New Window [Feb 25, 2025]

Product Description 1. Multi-directional and multi-angle spraying process - solve the problem of high-part dead-angle spraying; 2. Wide applicability - suitable for complex parts, variable parts, high speed and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
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9044.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop Open Details in New Window [Feb 25, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: &plusmn;10-15&mu;m@3&sigma;; Die attach mode: &plusmn;10-25&mu;m@3&sigma;; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

State-of-The-Art UPVC CPVC PVC Pipe Production Machine for Water Supply
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9045.

State-of-The-Art UPVC CPVC PVC Pipe Production Machine for Water Supply Open Details in New Window [Feb 25, 2025]

Introduction The HDPE Pipe Extrusion Machine stands as a stellar example of modern engineering, widely embraced across the nation for water supply, wastewater management, gas distribution, and domestic plumbing ...

Company: Zhangjiagang City Yili Technology Co., Ltd.