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Mps-0806L Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform
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9421.

Mps-0806L Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Open Details in New Window [Feb 28, 2025]

Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's super customized system, greatly meeting the needs of customers. Product ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Industry-Leading Technical Level Small Format Fiber Laser Cutting Machine with International ...
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9422.

Industry-Leading Technical Level Small Format Fiber Laser Cutting Machine with International ... Open Details in New Window [Feb 28, 2025]

Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is mainly used for cutting metal sheets and ceramic substrates, with a closed ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ...
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9423.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ... Open Details in New Window [Feb 28, 2025]

Product Description MPS-1010D is a product specially for the metal sheet industry, mainly used for cutting 0.5mm-16mm metal flat plates. It has a closed structure, superior performance, stability, and extremely high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Precision Laser Trimming Machine for Circuit Function Trimming
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9424.

Fully Automatic Precision Laser Trimming Machine for Circuit Function Trimming Open Details in New Window [Feb 26, 2025]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
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9425.

China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine Open Details in New Window [Feb 26, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Ssx-Pecvd Tube Type Automatic Loading and Unloading Wafer Machine
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9426.

Ssx-Pecvd Tube Type Automatic Loading and Unloading Wafer Machine Open Details in New Window [Feb 25, 2025]

Product Description G Texturing And Etching Automatic Loading And Unloading Machine Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process Main Technical Parameter Capacity(2 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Real-Time Detection Laser Drilling Machine for Circuit Board
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9427.

High-Precision Real-Time Detection Laser Drilling Machine for Circuit Board Open Details in New Window [Feb 25, 2025]

Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry
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9428.

Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry Open Details in New Window [Feb 25, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
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9429.

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine Open Details in New Window [Feb 25, 2025]

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn
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9430.

Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn Open Details in New Window [Feb 25, 2025]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine
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9431.

Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine Open Details in New Window [Feb 25, 2025]

Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Made in China Semiconductor Chip Placement Equipment High-Precision Dispensing Machine
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9432.

Made in China Semiconductor Chip Placement Equipment High-Precision Dispensing Machine Open Details in New Window [Feb 25, 2025]

Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Efficient Film Discharging Packing Wrap Pallet Wrapping Machine for Scales
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9433.

Efficient Film Discharging Packing Wrap Pallet Wrapping Machine for Scales Open Details in New Window [Feb 05, 2025]

Product Description Discover the groundbreaking PS-K120S G3 by Prime Systems – an innovative, all-encompassing stretch wrap solution that elevates your wrapping, weighing, and measuring tasks to new ...

Company: Taizhou Shengbai Electronics Co., Ltd.

High Accuracy Manual Surface Grinding Machine Tat618s
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9434.

High Accuracy Manual Surface Grinding Machine Tat618s Open Details in New Window [Jan 22, 2025]

High accuracy manual surface grinding machine TAT618S The product is a carriage moving surface grinder, which mainly uses the periphery of the grinding wheel to grind the plane of the workpiece and the end face of ...

Company: Suzhou Talent Import and Export Co., Ltd.

Surface Grinding Machine for Metal Cutting Work Tat-614s
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9435.

Surface Grinding Machine for Metal Cutting Work Tat-614s Open Details in New Window [Jan 22, 2025]

The product is a carriage moving surface grinder, which mainly uses the periphery of the grinding wheel to grind the plane of the workpiece and the end face of the grinding wheel to grind the vertical surface of the ...

Company: Suzhou Talent Import and Export Co., Ltd.