Jiangsu Profile
Product List
18421. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips 
[Feb 28, 2026]
[Feb 28, 2026] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
18422. Precision Laser Cutting Machine for PCB and Flexible Circuits [Feb 28, 2026]
[Feb 28, 2026] Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...
18423. Precision Laser Annealing Equipment for Advanced Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low ...
18424. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18425. High-Efficiency Plasma Cleaner for Wafer Photoresist Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18426. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
18427. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
18428. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
18429. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
18430. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18431. Advanced Stealth Dicing Machine Solutions for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
18432. Precision Laser Cutting Equipment for Superior Grooving Performance [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
18433. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
18434. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18435. Silicon Sapphire LED Solar Wafer Laser Stealth Dicing Equipment with Dry Process [Feb 28, 2026]
[Feb 28, 2026] Product Description This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting ...
