Jiangsu Profile
Famous Export Brand
Product List
21016. High Performance Wafer Annealing Equipment Using UV Laser for Bsi CCD 
[Nov 03, 2026]
[Nov 03, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
21017. Precision Laser Drilling Machines for Zirconium and Alumina Materials [Nov 03, 2026]
[Nov 03, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
21018. High Performance Vertical Furnace for Sic and Pi Coating Applications [Nov 03, 2026]
[Nov 03, 2026] Fully Automatic Sic/Pi Composite Film Coating Vertical Furnace equipment manufacturer Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The ...
21019. Advanced Laser Debonding Technology for Efficient Manufacturing Solutions Equipment [Nov 03, 2026]
[Nov 03, 2026] Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...
21020. Advanced Drilling Solutions for Challenging and Brittle Materials [Nov 03, 2026]
[Nov 03, 2026] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
21021. High-Quality Sic Wafer Production Tools with Advanced GaN Polishing [Oct 29, 2026]
[Oct 29, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes. Product ...
21022. 6 to 8 Inch Silicon Carbide Annealing Equipment with Autonomous Laser Optics [Oct 29, 2026]
[Oct 29, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
21023. Precision Laser Cutting Machine with Customizable Laser Head for Industrial Applications [Oct 19, 2026]
[Oct 19, 2026] High Precision Laser Grooving Cutting Equipment with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
21024. Advanced Fully Automatic CMP Polisher for Wafer Cleaning and Processing [Oct 19, 2026]
[Oct 19, 2026] Product Description Fully Automatic CMP Polisher is designed for thin film (dielectric layer) processing, offering user-friendly operation and strong compatibility. By simply changing the polishing head, it can ...
21025. Rock Wool Acoustic Ceiling Panels Sound Absorbing Ceiling Board Material Stonewool Ceilings [Sep 27, 2026]
[Sep 27, 2026] DEGOFON Stonewool Acousticl Ceilings The Production process The base material of Degofon ceiling products is stone wool (resin bonded mineral wool) produced according to the principles of a volcanic eruption. By means ...
21026. Galvanized Carbon Steel Sheet Metal Frame for Rail Transit with Welding [Nov 02, 2026]
[Nov 02, 2026] Hehua Factory Hehua Machinery Technology (Kunshan)Co, Ltd. Hehua Machinery Technology (Kunshan) Co., Ltd. was established in 2018, and its subsidiary Shanghai Huaheda Machinery Technology Co., Ltd. was established in ...
21027. Advanced Dry-in/Dry-out Wafer Polishing Machine System for Precision CMP [Oct 15, 2026]
[Oct 15, 2026] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
21028. Precision Eutectic Die Bonder for Next-Gen Wafer Bonding [Oct 15, 2026]
[Oct 15, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
21029. Advanced Semiconductor Laser Annealing Equipment for Precise Processing [Oct 15, 2026]
[Oct 15, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
21030. High-Precision UV Laser Annealing Equipment for Bsi CCD Wafers [Oct 15, 2026]
[Oct 15, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...
