Jiangsu Profile
Product List
18286. Low-K Waferlaser Grooving and Scribing Machine with Ultra-Fast UV Picro-Second Laser 
[Aug 20, 2025]
[Aug 20, 2025] Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, ...
18287. Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width [Aug 20, 2025]
[Aug 20, 2025] Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, ...
18288. High Speed Laser Stealth Cutting Machine Wafer Surface Tracking System [Aug 20, 2025]
[Aug 20, 2025] High Speed Laser Stealth Cutting Machine Wafer Surface Tracking System Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform. Equipped with high precision ...
18289. 200mm-300mm Full-Automatic Laser Stealth Cutting Equipment for Mems, RFID [Aug 20, 2025]
[Aug 20, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with high precision dynamic focus tracking and compensation system to ensure the ...
18290. Fully Automatic Frame Laser Barcode Engraving Machine with Secs-Gem Communication Networking ... [Aug 19, 2025]
[Aug 19, 2025] Product Description Product Features Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection Vision recognizes laser printed 2D codes Automatic generation of Mapping data SECS-GEM ...
18291. High Efficiency Laser Stealth Silicon Wafer Cutting Equipment with Advanced Intelligent System [Aug 19, 2025]
[Aug 19, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with high precision dynamic focus tracking and compensation system to ensure the ...
18292. Automatic Laser Deflashing Machine with Automatic Loading and Unloading Function [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Laser scanning and vaporization for deflashing. No chemical softening or high-pressure water jetting required Optical shaping technology, ensuring no damage to tube pins.Improving ...
18293. Laser Decapping Machine with Position Preview Function for Packaging & Testing Line [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Position preview function,flexible setting of open cover shape, position and size Laser distance measurement with automatic focus,CCD video coaxial observation of laser ...
18294. High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer [Aug 18, 2025]
[Aug 18, 2025] High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...
18295. Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer [Aug 18, 2025]
[Aug 18, 2025] Integrated Self-Developed Advanced Laser Internal Modification Machine for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...
18296. Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production [Aug 18, 2025]
[Aug 18, 2025] Laser Internal Modification Machine for Lt/Ln Wafer Compatible with 4/6 Inch Production Product Description Laser Internal modification machine for lt/ln wafer Equipment features: 1. Specially designed laser ...
18297. Automated Production Sic / Si Laser Wafer Internal Modification Machine [Aug 18, 2025]
[Aug 18, 2025] Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision ...
18298. Improve Surface Adhesion Plasma Cleaning Equipment with Fine Cleaning and Static Elimination [Aug 18, 2025]
[Aug 18, 2025] Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - fault sound and light alarm and menu ...
18299. Customized High Efficiency Laser Trimming Machine for Circuit Board Industry Line Repair [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
18300. Manufacture Laser Trimming Machine for LED, Mini LED Direct Display Module [Aug 18, 2025]
[Aug 18, 2025] Product Description Product Features Custom C02 or UV/Green picosecond laser Self-developed software and processing technology that meets different process requirements Glue removal and window opening Support ...
