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Product List
19321. Bag Package 20kg 25kg Grain Granule Green Beans Rice Filling Packing Machine 
[Mar 04, 2026]
[Mar 04, 2026] Introduction of the Machine: A quantitative weighing packaging machine is an automated weighing and packaging device. Through high-precision weighing sensors and a fast-response control system, it weighs bulk materials ...
19322. 5kg 10kg 25kg Bag Packaging Bagging Machine Flour Powder Granule Packing Machine [Mar 04, 2026]
[Mar 04, 2026] Introduction of the Machine: A quantitative weighing packaging machine is an automated weighing and packaging device. Through high-precision weighing sensors and a fast-response control system, it weighs bulk materials ...
19323. High Precision Sheet Metal Fabrication Stamping Part for SUS/Aluminium Material [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
19324. New Technology Txj1000 Concentric Stranding Machine for Manufacturing Aluminium Stranded Conductors [Mar 02, 2026]
[Mar 02, 2026] Product Introduction CONCENTRIC STRANDING LINE for manufacturing ACSR, copper and aluminium stranded conductors The concentric stranding machine is designed specifically for no-back-twist stranding and pressing of ...
19325. Advanced Electroplating Cleaning Machine for Precision Metal Finishing [Feb 28, 2026]
[Feb 28, 2026] High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...
19326. High-Performance Sic Laser Annealing System for Wafer Efficiency [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
19327. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
19328. High Precision Single Mode Alignment System [Feb 28, 2026]
[Feb 28, 2026] Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 µm) to maximize coupling ...
19329. Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...
19330. High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry [Feb 28, 2026]
[Feb 28, 2026] Product Description Wafer Handling and Marking System - Technical Overview Key Features Wafer Compatibility Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options). Adaptable to ...
19331. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
19332. High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System [Feb 28, 2026]
[Feb 28, 2026] Deep Reactive Ion etching of Silicon ICP Etcher The ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible ...
19333. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
19334. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
19335. Advanced Laser Wafer Marking System for Precision Depth Control [Feb 28, 2026]
[Feb 28, 2026] High Precision Laser Processing&Depth Control Wafer Laser Marking Machine Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto ...
