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Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot
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26146.

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Open Details in New Window [Dec 13, 2025]

Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Electric Copper Wire Winder Automatic Coil Winding Machine Automatic Big Wire Electric Motor Stator ...
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26147.

Electric Copper Wire Winder Automatic Coil Winding Machine Automatic Big Wire Electric Motor Stator ... Open Details in New Window [Dec 06, 2024]

Product Description 1.Application The equipment is used for rewinding aluminum rods with a diameter of 9.5mm and 12mm. Winding,laying-out,package turning and other actions are intelligently controlled by PLC. The ...

Company: Changzhou Optima Technology Co., Ltd.

Wl-Dmrs01 Cable Tube Marking Loading Heating Machine
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26148.

Wl-Dmrs01 Cable Tube Marking Loading Heating Machine Open Details in New Window [Nov 03, 2023]

Product description: Wire Shrink Tube Marking and Shrinking Machine This is a semi-automatic wire harness processing machine. It can insert, mark and shrink the wire heat shrinkable tubes in one go. ...

Company: Suzhou Crown Electronic Technology Co., Ltd.

2t Wire Stripping and Wire Terminal Machine
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26149.

2t Wire Stripping and Wire Terminal Machine Open Details in New Window [Nov 24, 2022]

Product description: Easy operate industrial wire stripping terminal crimping machine Different crimping applicator availabel, eg: loose terminal mold die, horizental terminal mold die and straight feeding terminal ...

Company: Suzhou Crown Electronic Technology Co., Ltd.

Wl-810n Multicore Cable Cutting and Stripping Machine
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26150.

Wl-810n Multicore Cable Cutting and Stripping Machine Open Details in New Window [Dec 23, 2025]

WL-810N Multi-core Cable Cutting and Stripping Machine Our multi-core wire cutting and stripping machine is a versatile and efficient tool designed for precision cutting and stripping of multi-core wires. This ...

Company: Suzhou Crown Electronic Technology Co., Ltd.

High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine
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26151.

High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine Open Details in New Window [Dec 13, 2025]

Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semiconductor Industry Pi Curing Oxygen-Free Oven Machine for Flexible Circuit Board Printing
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26152.

Semiconductor Industry Pi Curing Oxygen-Free Oven Machine for Flexible Circuit Board Printing Open Details in New Window [Dec 13, 2025]

Product Description PI curing oxygen-free oven PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing
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26153.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing Open Details in New Window [Dec 13, 2025]

High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Innovative Plasma Treatment Machine for Effective Surface Cleaning
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26154.

Innovative Plasma Treatment Machine for Effective Surface Cleaning Open Details in New Window [Dec 13, 2025]

Plasma Treatment System Cleaning Machine Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Semi-Automatic Small Vertical Chain Bucket Potato Chips Packing Machine Banana Slice Packing Machine
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26155.

Semi-Automatic Small Vertical Chain Bucket Potato Chips Packing Machine Banana Slice Packing Machine Open Details in New Window [Aug 09, 2024]

Technical parameters: Production capacity 15-40 bags/min Filling range 50-1000ml Forming bag size L 50-300mm, W 50-210mm Maximum film width 450mm Power supply AC220V, 50/60Hz, 1.9KW Machine weight About ...

Company: Suzhou Yangbang Machine Co., Ltd

EMI Shielding Foam Gasket Die Cutting Machine
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26156.

EMI Shielding Foam Gasket Die Cutting Machine Open Details in New Window [Jan 21, 2026]

Gasket Die Cutting Machine for EMI Shielding Foam Feature: 1. Special body mechanism design 2. Electric control system adopts the world famous brand PLC and man-machine interface control 3. Hydraulic control ...

Company: Kunshan Dapeng Precision Machinery Co., Ltd.

CE Approved Sheet Nickel Plate Shape Cutting Machine
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26157.

CE Approved Sheet Nickel Plate Shape Cutting Machine Open Details in New Window [Jan 19, 2026]

Dp-650p Sheet Nickel Plate cutting Machine Specialists in Die Cutting Machines Powerful, Precise, Fast. Suitable for sheet materials Available in a wide range of powers from 8 tons to 60 tons with cutting ...

Company: Kunshan Dapeng Precision Machinery Co., Ltd.

Vertical Automatic Stick Sachet Ketchup Liquid Oil Sauce Paste Vinegar Packaging Filling Bag ...
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26158.

Vertical Automatic Stick Sachet Ketchup Liquid Oil Sauce Paste Vinegar Packaging Filling Bag ... Open Details in New Window [Dec 24, 2025]

YangBang Vertical Automatic Stick Sachet Ketchup Liquid Oil Sauce Paste Vinegar Packaging Filling Bag Bagging Packing Machine Product Description Function and features: Computer control system, ...

Company: Suzhou Yangbang Machine Co., Ltd

High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
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26159.

High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device Open Details in New Window [Dec 13, 2025]

Product Description Mainly used in the final process of surface mount semiconductor device production, it can automatically complete the electrical parameter testing, classification and selection storage, laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
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26160.

High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device Open Details in New Window [Dec 13, 2025]

Product Description This machine is equipped with a wafer splitting device for brittle materials such as 2 "~8" LED/SIC/glass/ceramic. The laser processed wafer is supported by the receiving platform as a reference, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.